Search News

Foundry News

• Integrated silicon photonics: making the quantum future a reality (Monday, November 25, 2024)
• GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform (Sunday, November 24, 2024)
• TSMC drives A16, 3D process technology (Wednesday, November 20, 2024)
• GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing (Tuesday, November 19, 2024)
• Japan proposes $1.3bn investment in Rapidus (Tuesday, November 19, 2024)
• Samsung Reportedly Joins TSMC in Halting 7nm and Below AI Chip Supplies to China (Monday, November 11, 2024)
• Where the Future Begins: Samsung Showcases Pioneering Innovations for AI and Automotive Technologies at electronica 2024 in Munich (Sunday, November 10, 2024)
• U.S. restricts TSMC's export of advanced chips to China (Sunday, November 10, 2024)
• TSMC and GlobalFoundries finalize CHIPS Act funding agreements (Wednesday, November 6, 2024)
• M31 Launches USB4 IP for TSMC 5nm Process (Tuesday, November 5, 2024)
• Intel's Foundry Struggles Deepen As TSMC Rules Out Fab Acquisition (Monday, October 28, 2024)
• Alchip Announces Successful 2nm Test Chip Tapeout (Sunday, October 27, 2024)
• Rapidus Plans Second Plant for 1.4nm Process if 2nm Mass Production Proceeds Smoothly (Sunday, October 27, 2024)
• GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile (Tuesday, October 22, 2024)
• Google Reportedly Switching To TSMC 3nm 'N3E' Process For Its Tensor G5, Tensor G6 To Be Mass Produced On The More Advanced 'N3P' Technology (Tuesday, October 22, 2024)
• China's first 3nm SoC by Xiaomi marks a seven-year gap since its last launch, likely manufactured by TSMC (Monday, October 21, 2024)
• Improved materials for microchip interconnections (Monday, October 21, 2024)
• Intel Explores Foundry Alliance with Samsung in High-Level Talks (Monday, October 21, 2024)
• Samsung Foundry Pushes Up The Race Against TSMC In "Process Superiority", Starts Prepping 2nm & 1.4nm Production Lines (Tuesday, October 15, 2024)
• Credo Announces PCI Express 6 /7, Compute Express Link CXL 3.x Retimers, and AEC PCI Express Product Line at OCP Summit 2024 (Sunday, October 13, 2024)
• Samsung's Next Move? Early HBM4 Mass-production and 2nm Foundry Solutions Could Be the Cure (Sunday, October 13, 2024)
• TSMC "already planning" for more European fabs (Sunday, October 13, 2024)
• IEDM: CFETs make progress at 5nm and 7angstrom (Thursday, October 10, 2024)
• Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production (Tuesday, October 8, 2024)
• Intel, TSMC to detail 2nm processes at IEDM (Tuesday, October 8, 2024)
• Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes (Tuesday, October 1, 2024)
• QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time (Monday, September 30, 2024)
• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology (Sunday, September 29, 2024)
• Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award (Wednesday, September 25, 2024)
• EnSilica joins TSMC Design Center Alliance (Wednesday, September 25, 2024)
• Siemens extends collaboration with TSMC to advance integrated circuit and systems design (Wednesday, September 25, 2024)
• Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design (Wednesday, September 25, 2024)
• TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions (Wednesday, September 25, 2024)
• Intel's entire turnaround plan hinges on this one new chip family - Clearwater Forest pictured, Intel's first 18A chip slated for high-volume manufacturing (Monday, September 23, 2024)
• TSMC's Strategic Win: Full-Scale Semiconductor Production Starts Ahead of Schedule (Thursday, September 19, 2024)
• Samsung Secures US AI Chip Firm "Ambarella" Orders For Its 2nm Process, Signaling A Breakthrough (Saturday, September 14, 2024)
• Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant (Wednesday, September 11, 2024)
• Adani Group partners Israel's Tower Semiconductor to build $10 billion chip plant in India: All details (Thursday, September 5, 2024)
• Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development (Thursday, September 5, 2024)
• Samsung and TSMC Unlikely to Be Buyers for Intel's Rumored Foundry Business Sale (Monday, September 2, 2024)
• OpenAI joins Apple in securing TSMC's A16 Angstrom process for in-house AI chip (Sunday, September 1, 2024)
• Intel considers foundry split, fab cancellations (Sunday, September 1, 2024)
• Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce (Sunday, September 1, 2024)
• Efficient Computer signs an agreement with GlobalFoundries to build MRAM chips on the GF 22FDX process (Saturday, August 31, 2024)
• Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry (Thursday, August 29, 2024)
• Finwave Semiconductor and GlobalFoundries Partner on RF GaN-on-Si Technology for Cellular Handset Applications (Thursday, August 29, 2024)
• Accelerating AI with Essential Chips at GlobalFoundries Technology Summit 2024 (Wednesday, August 28, 2024)
• Intel pursues successes in the 18A manufacturing process (Tuesday, August 27, 2024)
• Samsung's Foundry Strategy Focuses on AI/HPC Growth and Enhanced 2nm Process Amid TSMC's Dominance (Tuesday, August 27, 2024)
• Samsung's new 2 nm foundry process to cut chip size by 17% (Thursday, August 22, 2024)