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Friday, November 14, 2025

• IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter-Ready SoCs
• CAST Introduces JPEG XL Encoder IP Core for High-Quality, On-Camera Still-Image Compression
• SkyeChip Berhad and Persimmons, Inc. Announce Strategic IP Licensing Partnership

Thursday, November 13, 2025

• Light into data: How silicon photonics is powering the AI data center revolution
• European Technological Sovereignty: Visionary or Illusory?
• TSMC sales solid, but may be slowing
• Keysight Named a Leader in 2025 Gartner® Magic Quadrant™ for AI-Augmented Software Testing Tools
• Key ASIC Signals Strong Growth Momentum Amid AI Boom
• Siemens and NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing
• Metalenz and UMC Bring Breakthrough Face Authentication Solution Polar ID to Mass Production
• TSMC Board of Directors Meeting Resolutions
• QuickLogic Reports Fiscal Third Quarter 2025 Financial Results
• Cadence Welcomes ChipStack
• Innatera signs Joya as ODM customer, bringing neuromorphic edge AI into everyday connected products
• VeriSilicon and Google Jointly Launch Open-Source Coral NPU IP
• lowRISC® and Partners to Deliver Commercial-Quality, Open-Source CHERI Secure Enclave with InnovateUK Support
• How Advanced Packaging is Unleashing Possibilities for Edge AI
• GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers

Wednesday, November 12, 2025

• United Micro Technology and Ceva Collaborate for 5G RedCap SoC to Accelerate Connected Vehicle Adoption
• Ceva, Inc. Announces Third Quarter 2025 Financial Results
• Secure-IC, now a part of Cadence, unveils Securyzr™ Xperience, an Exclusive Gateway to Security Innovation

Tuesday, November 11, 2025

• Blaize Deploys Arteris NoC IP to Power Scalable, Energy-Efficient Edge AI Solutions
• CAST Reaches 200 CAN IP Core Customers

Monday, November 10, 2025

• The ISA Wars Have Ended And The Heterogeneous CPU Era Has Arrived
• Day 2 of PIC Summit: Photonic Chip Applications Taking Centre Stage
• High Tech Campus Eindhoven Invests in, and Constructs Building and Cleanroom Facilities for TNO’s 6-inch Photonic Chip Pilot Line
• TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens
• TSMC’s 3nm Process Has Entered ‘Golden Period Of Mass Production,’ Estimates State That Monthly Wafer Production Can Reach 160,000 Units By The End Of 2025
• QuickLogic Accelerates Space Innovation with Secure, Customizable eFPGA Hard IP
• Keysight Recognized with 2025 TSIA STAR Award for Excellence in Omnichannel Customer Experience Optimization
• Global Semiconductor Sales Increase 15.8% from Q2 to Q3; Month-to-Month Sales Grow 7.0% in September
• Adeia Initiates Patent Infringement Litigation Against AMD
• TSMC October 2025 Revenue Report

Friday, November 7, 2025

• Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions

Thursday, November 6, 2025

• CoreHW’s Locator and Tag Series Achieve Bluetooth Certification
• BOS Semiconductors Driving Innovation in Automotive AI Chips
• Canadian semiconductor leaders see opportunity, and risk, in US takeovers
• SEMI Reports Worldwide Silicon Wafer Shipments Increase 3% Year-on-Year in Q3 2025
• European sales of semiconductors up 7.2% QoQ in the last quarter
• SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles
• Keysight and MediaTek Collaborate to Advance Pre-6G Integrated Sensing and Communication Technology
• RISC-V Summit spurs new round of automotive support
• Thalia Design Automation announces AMALIA Platform release 25.3 qualified for advanced process nodes down to 4nm
• Europe Must Play to Its Strengths
• Samsung’s Taylor Plant In Texas About To Commence Operations, New Report Says ASML Will Form A Team Soon To Set Up EUV Machinery And Ease Production Transition
• Perceptia Updates Design Kit for pPLL03 on GlobalFoundries 22FDX Platform
• Logic Fruit Technologies Appoints Sunil Kar as President & CEO to Accelerate Global Growth

Wednesday, November 5, 2025

• Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure
• CAST Expands Security IP Line with New Family of Post-Quantum Cryptography Cores

Tuesday, November 4, 2025

• Arteris Selected by Altera to Advance Intelligent Computing Across Cloud-to-Edge Applications

Monday, November 3, 2025

• Siemens and Capgemini deepen partnership to empower industries for the next era of manufacturing
• ASIL Qualified MIPI C-PHY/D-PHY IP Core Delivering Industry-Leading Performance for Automotive SoCs in advanced process nodes
• QuickLogic to Exhibit at Embedded World North America 2025
• Recycling Rare Earths: Europe’s Push for Independence
• Samsung Teams With NVIDIA To Lead the Transformation of Global Intelligent Manufacturing Through New AI Megafactory
• TSMC A14 fab construction approved, set to start soon: Science park
• Cadence Completes Acquisition of Secure-IC
• The next RISC-V processor frontier: AI
• Arm Opens Access to Chiplet Architectures and AI Platforms
• Chiplet-Based Solutions Accelerate the Development of Embedded NVM
• BOS Semiconductors and Tenstorrent Partner to Build an Open Chiplet Ecosystem
• Keysight Advances Quantum Engineering with New System-Level Simulation Solution
• GlobalFoundries and Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
• Introducing Microservice Store - A New Era for Embedded Systems Begins
• Qualitas Semiconductor Expands Global Presence with 4nm UCIe and PCIe Gen 6.0 IP Licensing Agreement in the U.S. AI Market