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Thursday, April 23, 2026

• EU unlocks €63M to accelerate AI in health and safety
• Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
• LLMs in Transition: What Research, Real World Practice, and Europe Are Driving Forward Today
• Credo to Highlight Next-Generation Connectivity Solutions for AI Infrastructure at TSMC 2026 Technology Symposium
• Europe’s best-performing stock of 2026 rides AI photonics wave
• European Consortium Launches €50 Million SPINS Pilot Line to Industrialize Semiconductor Quantum Chips
• TSMC Q1 revenue tops $35.9bn on strong 3nm demand
• Wind River Joins the CHERI Alliance and Collaborates with Innovate UK to Accelerate Cybersecurity Innovation
• JEDEC® Previews LPDDR6 Roadmap Expanding LPDDR into Data Centers and Processing-in-Memory
• Cadence Collaborates with TSMC to Accelerate Design of Next-Generation AI Silicon
• Siemens collaborates with TSMC to advance AI for semiconductor design
• Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows
• TSMC Debuts A13 Technology at 2026 North America Technology Symposium
• Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs

Wednesday, April 22, 2026

• Silicon Creations Celebrates 20 Years of Global Growth and Leadership in 2nm IP Solutions
• GUC Announces 3nm 12 Gbps HBM4 PHY and Controller
• Arasan achieves the Industry’s First ASIL-D Certification for its CAN XL IP Core

Tuesday, April 21, 2026

• Crypto Quantique Unveils Latest Lightweight Cryptographic Primitives for Securing the Edge
• Arteris and MIPS Partner to Accelerate Development for Physical AI Platforms
• MIPI A-PHY Tx and Rx IP Cores: Production-Proven, 6.4 Gbps Automotive Connectivity in 12FFC
• DCD-SEMI expands its cryptographic CryptOne system with EdDSA Curve25519 IP core for secure embedded systems
• Dnotitia Closes KRW 90 Billion Series A to Accelerate AI Storage Expansion

Monday, April 20, 2026

• Crypto Quantique Unveils Latest Lightweight Cryptographic Primitives for Securing the Edge
• Successful Bern medtech agreement extended by three years
• QuickLogic Appoints Quantum Leap Solutions as Authorized Sales Representative
• Bosch, Qualcomm expand partnership to include ADAS technology
• CoreHW Expands RTLS Portfolio with All-in-One CoreRTLS Software Platform
• Omnitrx introduces Omni500 Ethernet Evaluation Platform, Built on Comcores Expertise
• BrainChip and Quantum Ventura’s CyberNeuro-RT™ Named 2026 Enterprise AI Product of the Year by TMCnet
• Memory Is the New Compute: Why SK Hynix’s Investment in Semidynamics Signals a Structural Shift in AI Architecture
• Protocol, Link, & Physical: Synopsys Debuts First ‘Complete’ Storage
• TSMC Tightens 2nm Grip While Samsung Foundry Targets the Alternative Demand
• BOS Semiconductors to Participate in Auto China 2026, Showcasing Physical AI and Automotive AI SOC Technologies

Thursday, April 16, 2026

• Sofics and Alcyon Photonics Partner to Support Next-Generation Photonic Systems
• Three Misconceptions About the $402B Semiconductor Foundry Industry
• Japanese Government Provides Additional 5.9 Trillion Won to Rapidus
• Credo Agrees to Acquire DustPhotonics, Accelerating Expansion into Silicon Photonics and Next Generation Optical Connectivity
• European Commission greenlights €211 million funding for Cambridge graphene photonics spinout
• For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 3
• 8 Wi-Fi security guidelines issued by Wireless Broadband Alliance
• Synopsys Solutions Support NASA's Artemis Program with Spacesuit Analysis and Communication System Development
• DeepX to produce next AI chip using Samsung Foundry’s 2-nanometer process
• How to Plan Agentic AI Deployment for Chip Design
• Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing
• AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms
• Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC’s 28nm SST eFlash
• Rapidus Opens Analysis Center and Rapidus Chiplet Solutions
• Three Foundry Companies and the "Everyone’s Challenge Fabless" Initiative… Full-Scale Support for Startups

Wednesday, April 15, 2026

• Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums

Monday, April 13, 2026

• Intel, Google Deepen Collaboration to Advance AI Infrastructure
• TSMC March 2026 Revenue Report
• NEDO Approves Rapidus’ FY2026 Plan and Budget for 2nm Semiconductor Projects
• Codasip Shifts Focus to Cyber-Resilient SoCs, Divests Low-End RISC-V Business
• IntoPIX Unleashes Zero‑Latency IP Video Streaming With JPEG XS, IPMX & SMPTE 2110 At NAB Show 2026
• OmniTrust and Synopsys collaboration enables earlier security validation of embedded systems
• RISC-V SoC supports voice-enabled IoT devices
• Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design
• BrainChip Unveils Radar Reference Platform to Bridge the ‘Identification Gap’ in Edge AI
• SiFive Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions; Company Valuation Now Stands at $3.65 Billion
• Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
• Intel Foundry Achieves Breakthrough with World's Thinnest GaN Chiplet Technology
• Rapidus Opens Analysis Center and Rapidus Chiplet Solutions
• Power Your Chiplets with 32Gbps Open AIB PHY IP Core — White-Box Licensed with Unlimited Usage and Full Modification Rights