Search News

Monday, July 27, 2026

• Scalable Network Interconnect IP Core Addresses Growing On-Chip Communication Challenges in Next-Generation SoCs
• Silvaco to Accelerate Physics-Based Digital Twins for Semiconductor Design and Manufacturing Using NVIDIA AI and Accelerated Computing
• Muse Semiconductor and True Circuits Announce New IP Access Program Offering High-quality PLLs to Universities at Low Cost
• Vietnam, Japan launch five joint semiconductor research projects
• How Industrial IoT Is Transforming Semiconductor Manufacturing
• AI in EDA Is Real, It’s Now, and It’s on Show at DAC 2026
• Post-Quantum Cryptography Incorporated into SoCs via eFPGA
• RISC-V Market Size To Exceed $25.07 Billion By 2035
• Charting RISC-V’s Future in HPC
• Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design
• Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
• Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies
• Synopsys Showcases Comprehensive Autonomous Engineering Workflows from Silicon to Systems, Developed with NVIDIA Technology
• True Circuits Announces the JSPICE™ Design Environment (JDE™) will be Offered to the JDE Ecosystem Open Source

Saturday, July 25, 2026

• Lee outlines plan to transform Korea into pillar of global AI supply chain
• South Korea’s semiconductor boom risks flatlining under US–China pressure

Friday, July 24, 2026

• Can India become the next semiconductor hub after Taiwan?
• Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience
• Synopsys Announces Earnings Release Date for Third Quarter Fiscal Year 2026
• True Circuits Announces the JSPICE™ Design Environment (JDE™) will be Offered Open Source at the Design Automation Conference
• Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
• Real Intent Launches Riven™ Sign-Off AI Agent for 10X Faster Sign-Off

Thursday, July 23, 2026

• Japan-based semiconductor expert sees broad cooperation opportunities with Vietnam
• Samsung, SK and Naver leaders to meet Nvidia CEO Jensen Huang in U.S. AI talks
• Arteris to Announce Financial Results for the Second Quarter 2026 on Thursday, August 6, 2026
• InfiniNode secures EUR 2 million financing to advance on-chip data movement technologies for next-generation compute systems
• EnSilica secures €1.1 million satellite chip orders as beamformer demand grows (LSE:ENSI)
• ELECTRA IC Unveils Comprehensive IP Core Suite for Next-Generation Post-Quantum Cryptography
• Agnisys unveils IDS-AI agentic framework and NoC automation at DAC 2026
• Intelligent and Adaptive AR Experiences with TDK
• Siemens to acquire Precision Innovations to expand AI-powered system-on-a-chip design exploration and optimization
• BrainChip Partners with Celus to Bring Its Neuromorphic Edge AI Processor to the CELUS Design Platform
• RISC-V Europe Summit 2026: Beyond Embedded Electronics
• Charting RISC-V’s Future in HPC
• Menta Contributes to the Successful Completion of the European Processor Initiative and Confirms its Role in Shaping Future Computing Architectures
• TES Electronic Solutions Introduces an Over-Voltage Lockout IP for the Protection of Battery-Powered Systems in X-FAB's XT018 – 0.18µm BCD-on-SOI Technology
• CEA-Leti Looks Beyond SRAM and DRAM as AI Reshapes the Memory Roadmap
• Keysight Addresses Cross-Domain Physics Issues That Leave Electronic Designs Vulnerable to Late-Stage Failure
• SemiAnalysis teardown shows SMIC's N+3 node matches Intel's 18A in metal pitch
• Samsung Foundry completes tape-out of Tesla’s next-gen AI chip

Wednesday, July 22, 2026

• Siemens to acquire Defacto Technologies to complement its EDA portfolio with automated SoC design creation

Tuesday, July 21, 2026

• Arteris Deployed by Speedata for Data Center Compute
• CAST Enhances Serial Memory Controller IP with Encryption, Low-Power, and ASIL-Ready Options

Monday, July 20, 2026

• Siemens and Cloudberry VC collaborate to accelerate European deep-tech innovation
• RISC-V CPU IP Core - TAE500 -- Accelerate Automotive SoC Development with Functional Safety-Ready Solutions
• TSMC Reports Second Quarter EPS of NT$27.25
• Alphacore excited to exhibit at IEEE Nuclear & Space Radiation Effects Conference (NSREC 2026) in San Juan, Puerto Rico
• BOS Semiconductors Participates in Physical AI Super Connect in Silicon Valley 2026
• Keysight and Sateliot Selected by European Space Agency to Develop Blockchain‑Enabled Framework for 5G Non‑Terrestrial Networks
• ZeroPoint Technologies Announces ZeroStream
• RISC-V Is Inevitable, State of the Union Keynote Argues
• MEMTECH announces MemVerify-LPDDR5x memory simulation & verification platform
• Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging
• Samsung Foundry completes tape-out of Tesla’s next-gen AI chip
• Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design

Friday, July 17, 2026

• QuickLogic and PQSecure Enable Reprogrammable Post-Quantum Cryptography for SoCs
• Dolphin Semiconductor and INTERA Group Announce Reference Platform Combining Analog Voice Sensing and Neuromorphic AI for Ultra-Low-Power Edge Intelligence

Thursday, July 16, 2026

• Defacto’s SoC Compiler Drastically Improved Productivity of L&T Semiconductor Technologies
• Cabinet approves Rs 1.27 lakh crore Semicon 2.0 to strengthen India’s semiconductor ecosystem
• Spain Semiconductor Industry Convenes to Forge Domestic Alliances
• TrendForce Forecasts Up to 18% Server DRAM Price Increase in 3Q
• TSMC Achieves Record $13.75 Billion Revenue in June 2026
• Intel Invests €5 Billion to Expand Manufacturing in Europe
• TSMC to raise mature-node foundry prices starting January 2027
• TYLsemi Raises $43 Million to Launch First Full-Stack Chiplet Platform for Custom AI Silicon
• Quadric Extends Series C to $46M with Second Close led by World Bank's IFC
• Five Test Considerations to Prepare for Q-Day
• EU unveils action plan for AI and cybersecurity
• Swissbit, Nexperia Partner on Secure Hardware Platforms
• Siemens expands Saskatoon R&D hub to advance Industrial AI in semiconductor design
• Axelera AI Publicly Releases Voyager Wingman, an AI Assistant That Speeds Application Development
• Dnotitia Unveils STAR-KV, Achieving UP to 20x KV CacheCompression, Selected as an ICML 2026 Spotlight Paper
• MIPS on the RISC-V Shift: ‘Physical AI Is Agentic AI at the Edge’
• New JEDEC® SPHBM4 Standard Enables HBM4-Class Bandwidth on Organic Substrates
• China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain
• SILITH and UMC Achieve Mass Production Milestone for Silicon Photonics
• Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?

Wednesday, July 15, 2026

• Analog Bits Expands Global Engineering Footprint with New Design Center in Dongtan, South Korea