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Wednesday, June 10, 2026

• Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
• Chips&Media Licenses Its Latest-Generation Video CODEC IP to Ambarella, Strengthening Strategic Collaboration in Global Edge and Physical AI Markets

Tuesday, June 9, 2026

• INNOSILICON Unveils Full Suite of High-Speed UALink IP, Powering Next-Gen Token Factories with Enhanced Productivity
• NimbleAI: A European consortium advances next-generation edge AI technologies and strengthens technological sovereignty
• Avant Technology Partners with Jade Design Automation to Provide IP/SoC Register Management Solutions
• Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
• MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA

Monday, June 8, 2026

• Meet T2M at MWC Shanghai 24th – 26th Jun’26: Showcasing Next-Generation IP Cores
• EnSilica wins seven-year, $75m manufacturing and supply contract
• Viettel launches 2026 technology talent program
• Global Semiconductor Sales Increase 11% Month-to-Month in April
• The AI-driven semiconductor supercycle accelerates
• Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI
• NVIDIA and TSMC push AI deeper into semiconductor fabs
• Chairman Chey Tae-won Meets TSMC Chairman C.C. Wei: "Strengthening Global AI Alliance"
• JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics
• Siemens Intros AI-Powered Library Characterizer to Speed IC Design
• Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA
• Rapidus Completes 150 Billion Yen Funding Round from Japan Government
• Intel CEO says TSMC a ‘partner’ in chip production
• Samsung’s 2nm Advance Draws on EDA Innovation from Cadence, Siemens, and Synopsys

Friday, June 5, 2026

• Meet T2M at RISC-V Summit Europe– Accelerating Next-Gen SoCs with Production-Proven IP Cores. 

Thursday, June 4, 2026

• Siemens and partners develop reference architecture purpose-built for NVIDIA AI data centers
• InPsytech Highlights UCIe Innovation at COMPUTEX with UCIe Live Demo and Ultra-high speed ONFI 6400 Development
• Soitec reports fiscal 2026 full-year results
• GlobalFoundries completes acquisition of Synopsys’ Processor IP Solutions Business, delivering a holistic technology platform for Physical AI
• Renesas Announces Leadership Transition in Engineering Organization
• QuickLogic Set to Join Russell 2000® and Russell 3000® Indexes
• Infineon launches EU flagship project Moore4Power to drive the next generation of sustainable power electronics
• Keysight Expands Photonics Design Ecosystem with GlobalFoundries PDK
• Innovation From Above: How Mesh Networks Help Control Drone Swarms
• Siemens unveils new 3D electrical systems design workflow for electromechanical innovation
• Keysight Introduces RF Signal Analyzers to Accelerate Wideband Wireless Design and Validation
• Cadence extends chip design agent to Level-5 autonomy
• Samsung Electronics Begins Shipment of Industry-First HBM4E Samples
• Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs
• NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing

Wednesday, June 3, 2026

• MicroIP and BrainChip Announce Strategic Ecosystem Partnership to Deliver Advanced Edge AI Hardware and Software

Monday, June 1, 2026

• Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution
• Industry Urges to Expand Push in Automotive Semiconductor Market
• Faraday Ranked in Top 5% in Corporate Governance Evaluation for Second Consecutive Year
• FortifyIQ Appoints Avishay Shraga as Chief Product Officer
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2026
• Keysight reports record revenue with orders topping $2bn
• Credo Completes Acquisition of DustPhotonics
• DisplayPort v1.4 Tx & Rx IP Cores with Industry-Proven up to 8K Support in 12FFC
• Keysight Tackles Semiconductor Talent Gap with Executable RF Design Whiteboard
• CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
• Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis
• Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
• SemiFive Showcases 3D-IC Technology at Samsung SAFE Forum
• Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
• Siemens and Samsung Foundry strengthen collaboration to advance silicon design enablement
• Analogue Insight Appoints Dr Tanya Mangoma as Chief Product Officer to Drive Customer-Led High-Speed Interconnect and Memory Solutions