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Monday, December 29, 2025

• RISC-V IP: T2M Showcases RISC-V Production IP Core Portfolio for Next-Generation SoCs at CES’26

Friday, December 26, 2025

• Challenges and Opportunities in the New Era of IoT Connectivity Opened by SGP.32 eSIM

Wednesday, December 24, 2025

• Global Foundry 2.0 Market Revenue Surges 17% YoY in 3Q 2025
• New Role of Ethernet in AI, Automotive, and Connectivity
• Nvidia stock plunges after Intel’s 18A move: what does it mean for AI chips?
• Partnership Drives RISC-V Adoption in Automotive
• The Chiplet Revolution: How Advanced Packaging and UCIe are Redefining AI Hardware in 2025
• BOS Semiconductors to Exhibit at CES 2026, Showcasing AI Box Demo for Next-Generation Mobility

Tuesday, December 23, 2025

• China urges Dutch government to revoke administrative order against semiconductor manufacturer Nexperia
• AI in 2025: Chips, robots, and the race for scale
• Samsung Set to Benefit from TSMC's 'N-2' Rule as AMD, Google Eye U.S. 2nm Production
• Qualitas Semiconductor Expands Automotive Momentum with 5nm IP Bundle Agreement

Monday, December 22, 2025

• Arm sheds billions in market capitalization after Qualcomm hints at RISC-V adoption with Ventara Micro acquisition

Saturday, December 20, 2025

• NVIDIA Synopsys Partnership: Accelerating Engineering Workflows with GPU and Agentic AI

Friday, December 19, 2025

• Semiconductor technology trends and predictions for 2026
• Trends for semiconductor and IC packaging materials market 2025-35
• Six IoT semiconductor predictions for 2026
• India Launches DHRUV64, First Indigenous 64-Bit Dual-Core Processor
• Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology
• Qualcomm Completes Acquisition of Alphawave Semi
• QuickLogic Announces Expanded Scope of Strategic Radiation Hardened FPGA Contract
• Omni Design Technologies Appoints Hinesh Shah as Vice President of Strategic Sales

Thursday, December 18, 2025

• VeriSilicon responds to the termination of the acquisition of Nuclei Smart Fusion: The RISC-V business layout plan remains unchanged, and the Point Semiconductor merger is proceeding concurrently.
• GlobalFoundries Accelerates and Strengthens Europe’s Semiconductor Ecosystem through Strategic Partnership with Cloudberry
• The Green Paradox: How Semiconductor Giants are Racing to Decarbonize the AI Boom
• Siemens' new PAVE360 Automotive drives next-generation vehicle development with real-world validation
• Canada Tempers AI Aspirations with Data Sovereignty
• Global Trends Overview: The Rapid Evolution of the USB-C Charging Cable Market
• Keysight Joins Forces with Singapore's Quantum Leaders to Advance Capabilities in the Design and Control of Qubits
• Using Synopsys Tools, Complex AI SoC Achieves Verification in 5 Weeks
• onsemi to Develop Next-Generation GaN Power Devices with GlobalFoundries
• Significant 8 nm Order at Samsung Foundry Linked to Futuristic Intel 900-series Chipset
• Addressing the Biggest Bottleneck in the AI Semiconductor Ecosystem
• Chinese SMIC Achieves 5 nm Production on N+3 Node Without EUV Tools
• Keysight Accelerates Automotive Innovation from Design to Defense at CES 2026
• Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics
• India Unveils DHRUV64: Nation’s First Indigenous 64-Bit Dual-Core Microprocessor
• Intel Installs ASML TWINSCAN EXE:5200B High-NA EUV Machine for 14A Node
• Samsung nears 2nm foundry deal with AMD as it closes gap with TSMC
• Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports
• Keysight Accelerates Electronic Design Productivity with Secure AI-Powered Assistants
• Toshiba to accelerate semiconductor design innovation with Siemens’ EDA software
• Quobly marks a new milestone towards industrialization with Soitec’s 28Si FD-SOI substrates now cycling in ST’s 300mm fab
• SiFive and IAR Collaborate to Advance the Automotive Ecosystem and Drive RISC-V Innovation in Automotive Electronics

Wednesday, December 17, 2025

• Europe picks its own lane at EFECS 2025 – Turning semiconductor strategy into competitive strength
• Deep Dive Into VSF TR-07 JPEG XS TS With A Wireshark Dissector
• Cadence's Zhuo Li discusses how their latest platform is reshaping LEC, low-power signoff, and ECO implementation using AI technologies.
• Rapidus unveils new AI design tools for advanced semiconductor manufacturing
• S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development