TSMC Enhances 0.13um Family
Hsinchu, Taiwan, R.O.C. – June 29 , 2009 - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it has released an enhanced version of its 0.13μm process to benefit customers’ cost and competition and to enable the integration of power management functions. The 0.13μm/0.11μm family now includes a slim standard cell, SRAM and I/O with substantial area reduction and the 0.13um process also adopts LD-MOS (5V~20V) on RF platforms to enable analog and power management applications. The slim platform is available in the third quarter this year while the LD-MOS on RF platforms will be available in Q4 this year.
To meet the ever shrinking requirements for basic consumer and RF applications, the slim platform I/O area achieves a 30% reduction and SRAM bit cells demonstrate a 25% reduction when compared with traditional offerings. Furthermore, a 0.13μm LD-MOS device built upon a RF platform enables SOC designs with power management functionality.
“This is another example of how TSMC is committed to enabling more efficient SoC design of wireless, consumer and communications devices using 0.13μm process technology,” said Dr. Simon Wang, senior director of Advanced Technology Business Division. “The result of these enhancements will spawn the next generation of innovation,” he said.
TSMC’s investment in R&D for technology and IP portfolios within the 0.13μm /0.11μm family now delivers a true 5V with Copper interconnect for the integration of analog, high-speed DSP, power management and watt-scale class-D amplification. Along with new features development for system-on-chip design, TSMC also offers a shrunken path to enhance customer’s competitiveness including sub-node and slim technology platform.
About TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company’s total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GIGAFABs ™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.
|
Related News
- NurLogic Further Expands Intellectual Property Offering With Standard Cell and I/O Libraries Utilizing TSMC's Advanced 0.13-Micron Process
- TSMC's Extremely Low Leakage Devices on 180nm eLL process empowers Dolphin Integration's IP offering
- Total solution for standard cell & I/O library, and memory IP characterization by Legend's tools
- Silicon Access Networks Broadens IP Offering: Full I/O cell library in TSMC 0.13G to be offered in addition to NPSI and SFI IP blocks
- NurLogic Partners With MOSIS to Offer Standard Cell and I/O Library Components With Low Volume Wafer Accessibility At Leading Foundries
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |