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   Headlines for Thursday Jul. 02, 2009
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TSMC Unveils First Commercial 65-Nanometer Multi-Time Programmable Non-Volatile Memory Technology
TSMC today announced the foundry segment’s first functional 65-nanometer (nm) multi-time programmable (MTP) non-volatile memory (NVM) process technology. The technology incorporates process-qualified MTP IP blocks jointly developed with Virage Logic.

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   Headlines for Wednesday Jul. 01, 2009
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NSCC Launches First AVS SD Decoder Optimized For The ARM Cortex-A8 Processor With NEON Technology
ARM and NSCC today announced that NSCC has successfully developed the first AVS Standard Definition (SD) decoder optimized for the ARM® Cortex™-A8 processor with NEON™ technology. The AVS (GB/T GB/T200090.2) is the second generation of source coding/decoding standard developed by the AVS Workgroup (Audio and Video Coding Standard Workgroup of China).

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   Headlines for Tuesday Jun. 30, 2009
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eInfochips Announces VMM-Enabled MIPI CSI-2, DSI & HSI and SDIO Verification IP for the Synopsys DesignWare Verification IP Alliance Program
eInfochips today announced the availability of Verification Methodology Manual (VMM)-enabled MIPI® CSI-2 (Camera Serial Interface), DSI (Display Serial Interface), HSI (High Speed Synchronous Interface) & SDIO Verification IP (VIP)

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   Headlines for Monday Jun. 29, 2009
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Samsung using 45-nm process for ARM-11 based processor
Samsung Electronics Ltd has started sampling its ARM11-based application processor that will be made on its 45-nm CMOS process technology.

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   Headlines for Friday Jun. 26, 2009
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Tiempo, IP company with breakthrough ultra-low power asynchronous design technology, raises 5 million Euros ($7 million) in Series B funding
Tiempo today announced it has closed a 5 million Euros Series B financing round with two new investors, Viveris Management and Oddo Private Equity. Previous Series A investors, i.e. EmerTec Gestion, Schneider Electric Ventures, INPG Entreprise SA and Alma Capital Finances, also participated to this round.

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   Headlines for Thursday Jun. 25, 2009
   Headlines for Wednesday Jun. 24, 2009
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Xilinx Accelerates Development of Next-Generation Systems With Industry's First Deployment of Targeted Design Platforms
Xilinx today released the Xilinx Base Targeted Design Platform aimed at accelerating the development of system-on-chip (SoC) solutions with Xilinx(R) Virtex(R)-6 and Spartan(R)-6 field programmable gate arrays (FPGAs).

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   Headlines for Tuesday Jun. 23, 2009
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Silicon startups get the squeeze
Top venture capitalists say opportunities are changing and narrowing for semiconductor startups because the costs of bringing a new processor or system-on-chip to market are becoming prohibitive and raising new funds to invest in high tech companies of any kind is getting increasingly difficult.

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   Headlines for Monday Jun. 22, 2009
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Tensilica Announces High-Performance ConnX Baseband Engine for LTE and 4G Wireless DSP Handsets and Base Stations
Tensilica today announced the first member of its new ConnX family of digital signal processor (DSP) cores for system-on-chip (SOC) design. The ConnX Baseband Engine enables efficient baseband processing for 3G, LTE (Long-Term Evolution) and 4G wireless equipment with its scalable, high-performance DSP architecture that provides industry leading computational throughput of 16 18-bit MACs per cycle.



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