Analysis: Inside Broadcom's bid for Beceem
Rick Merritt, EETimes
10/13/2010 9:03 AM EDT
SAN JOSE, Calif. – Beceem Communications has a solid team and solid financials, but not exactly the right product to get Broadcom Corp. into mainstream LTE markets quickly. But given Broadcom belief the 4G technology won't be widespread in handsets until at least 2015, the company has plenty of time to start new integrated designs that are the hallmark of its silicon strategy.
Broadcom bid $316 million to acquire Beceem which sells WiMax handset chips and has a multimode WiMax and LTE chip in development scheduled to sample early next year. That chip, the BCS500, will be in production in late 2011, according to an S-1 Beceem filed recently in an aborted plan to go public.
E-mail This Article | Printer-Friendly Page |
Related News
- Analysis gives first look inside Apple's A4 processor
- European Commission Approves Broadcom's Acquisition of VMware
- Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure
- Synaptics to Acquire Rights to Broadcom's Wireless IoT Connectivity Business
- TrendForce Presents Latest Analysis (Updated March 2020) of COVID-19 Pandemic's Impact on Global High-Tech Industries
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process