Elpida and Rambus Sign Patent License Agreement
SUNNYVALE, Calif.-- December 6, 2010-- Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies, today announced that it has renewed their patent license agreement with Elpida Memory, Inc. (Elpida, TSE: 6665), Japan's leading global supplier of Dynamic Random Access Memory (DRAM). This agreement covers Elpida's range of memory products including SDR, DDR, DDR2, DDR3, LPDDR, LPDDR2, GDDR3 and GDDR5 DRAM.
"We are extremely pleased to have licensed another one of the top three memory companies. This agreement continues our licensing momentum and renews a winning partnership that has produced best-in-class memory solutions for customers," said Sharon Holt, senior vice president and general manager of the Semiconductor Business Group at Rambus. "Elpida's customers now have the full benefit of licensed products using our patented innovations to enrich the consumer experience of electronic systems."
In addition to its leadership in industry-standard DRAM products, Elpida ships the world's fastest memory device, the 7.2Gbps XDR™ DRAM, based on the Rambus XDR memory architecture.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enriching the end-user experience of electronic systems. Rambus' patented innovations and breakthrough technologies help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Headquartered in Sunnyvale, California, Rambus has regional offices in North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.
|
Related News
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |