Pair plans multiprotocol WLAN chip set
Pair plans multiprotocol WLAN chip set
By Semiconductor Business News
February 26, 2002 (12:41 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020226S0021
NORCROSS, Ga. -- RF Solutions Inc. and Ellipsis Digital Systems Inc. today announced a partnership to develop a chip set for dual-band, multiprotocol wireless local area networks (WLANs) supporting 2.4- and 5-GHz standards. The new chip set will employ radio-frequency IC technology from Norcross-based RF Solutions and digital communications expertise from Ellipsis of Carlsbad, Calif., to support IEEE 802.11a and 802.11b networks as well as the recently drafted 802.11g protocols, the two companies said. The collaboration agreement covers design and development of multi-standard WLAN solutions to ensure compatibility between the products of the two companies. "Combining RF Solutions' WiFLEX and power amplifier expertise with Ellipsis' embedded baseband and MAC [media access control] solutions will enable our companies to provide innovative and first-to-market WLAN product offerings," said Mike Hooper, chief executive officer of RF Solutions. E llipsis is offering its E-1100 ISiS (integrated silicon and software) platform for 802.11a and E-2000 for a multi-standard 802.11a/b/g solution. Both products feature an integrated MAC, physical-layer (PHY) and digital conversion and compensation system for lower cost and power savings over extended operating ranges. RF Solutions is offering its RFS W5100 WiFLEX dual-band transceiver and RFS P5910 dual-band power amplifier. The alliance will develop a demonstration platform and reference design. Ellipsis' E-1100 will be available this summer, with the E-2000 following in the fall. RF Solutions' WiFLEX dual-band multi-mode RF transceiver will be available in sample quantities in the spring.
Related News
- Lantiq's New Wireless LAN Chips Set Benchmarks for Reach and Robustness
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
- Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
- Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |