IPhone 5 bill of materials estimate is $167.50
EETimes
9/12/2012 8:20 PM EDT
OTTAWA – The bill of materials for Apple’s new IPhone 5 comes in at an estimated $167.50 for the 16-Gb version, or about $35 higher than a comparable version of the IPhone 4S, according to a preliminary estimate by the tear down specialists at TechInsights.
The preliminary analysis by TechInsights, which is owned by UBM, the publisher of EE Times, is based on initial information about the IPhone 5 that was released by Apple in San Francisco on Wednesday (Sept. 12). The IPhone 5, which is scheduled to go on sale Sept. 21, is expected to sell for about $199 for the 16-Gb version.
TechInsight analysts also based their estimates on previous versions of 16-Gb IPhones, including the known features and cost of components for the IPhone 4 and 4S.
E-mail This Article | Printer-Friendly Page |
Related News
- iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
- iPhone 5 Carries $199 BOM, Virtual Teardown Reveals
- Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
- Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing