Intel's 450-mm wafer spend starts in 2013
Peter Clarke, EETimes
1/24/2013 6:55 AM EST
LONDON – Leading chip company Intel Corp. is planning to spend $2-billion preparing for transition to 450-mm diameter wafers in 2013.
The company has forecast a total capital expenditure for 2013 of $13 billion and the company's chief financial officer Stacy Smith broke the number for 450-mm developments out during a conference call with analysts to discuss the company's 4Q12 financial results.
"Capital spending for our core business is expected to be roughly flat to 2012. Additionally, we will spend roughly $2 billion to start building our first 450-millimeter development facility," Smith said.
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing