CES Mobile Wrap: DSP, GPU, CPU Redefined
Junko Yoshida, EETimes
1/13/2014 07:40 AM EST
LAS VEGAS — There is no such thing as “game over” for the mobile apps processor battle.
Evident at the International CES this year was that the ever-increasing flood of features into mobile devices is keeping silicon designers on their toes.
The new differentiators cropping up for mobile devices are the always-on mobile SoC that can be promptly awakened by voice activation, sensor fusion, multi-channel surround-sound audio, eye-tracking, post video processing, and more. An additional wrinkle is that many mobile SoCs are also being pitched as the brain that drives an automaker's in-vehicle infotainment system.
Such changes are prompting apps processor designers to rethink DSP, GPU, and CPU cores, giving birth to a new generation of "light" apps processors, designed as co-processors to be used in conjunction with a main apps processor. Many designers are also intent on beefing up the performance of their own apps processors, by re-crafting graphics cores (e.g., Nvidia's Tegra K1) and/or adding more processor cores (e.g., MediaTek's octa-core apps processor).
E-mail This Article | Printer-Friendly Page |
Related News
- Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm's Latest Premium Mobile Processors
- Arm announces new suite of IP for premium mobile experiences
- CEVA to Showcase Latest DSPs and Platform IPs for Mobile, Digital Home and Automotive at CES 2013
- Shanghai InfoTM Licences Range of ARM CPU and GPU IP to Address Full Range of Mobile Computing Devices
- Ventana and Imagination Partner to Deliver World's Highest Performance RISC-V CPU & GPU Solutions
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process