Intrinsic ID QuiddiKey® 300 - World's First PSA Certified Level 3 RoT Component IP
Altera and Intel Extend Manufacturing Partnership to Include Development of Multi-Die Devices
Collaboration Will Optimize Integration of 14 nm Tri-Gate Stratix 10 FPGAs with Heterogeneous Technologies into a Single System-in-a-Package
San Jose and Santa Clara, Calif., March 26, 2014– Altera Corporation (Nasdaq: ALTR) and Intel Corporation today announced their collaboration on the development of multi-die devices that leverage Intel’s world-class package and assembly capabilities and Altera’s leading-edge programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera’s Stratix® 10 FPGAs and SoCs using the 14 nm Tri-Gate process.
Altera’s work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera’s heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challengesimpacting high-end applications in the communications, high-performance computing, broadcast and military segments.
Intel’s 14 nm Tri-Gate process density advantage and Altera’s patented FPGA redundancy technology enable Altera to deliver the industry’s highest density monolithic FPGA die, offering greater integration of system components on a single die.Altera is leveraging its leadership in developing the largest monolithic FPGA die and Intel’s packaging technology to integrate even more capabilities into a single system-in-a-package solution. Intel’s manufacturing process is co-optimized to offer manufacturing simplicity consisting of turnkey foundry services that include the manufacturing, assembly and testing of heterogeneous multi-die devices. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.
“Our partnership with Altera to manufacture next-generation FPGAs and SoCs using our 14 nm Tri-Gate process is going exceptionally well,” said Sunit Rikhi, vice president and general manager, Intel Custom Foundry. “Our close collaboration enables us to work together in many areas related to semiconductor manufacturing and packaging. Together, both companies are building off one another’s expertise with the primary focus on building industry-disrupting products.”
“Our collaboration with Intel on heterogeneous multi-die device development reflects a shared commitment by both companies to improve the bandwidth and performance of next-generation systems,” said Brad Howe, senior vice president of research and development at Altera Corporation. “Leveraging Intel’s advanced manufacturing and chip packaging capabilities will allow Altera to deliver system-in-a-package solutions that have been identified as critical to meeting overall performance requirements.”
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.comand blogs.intel.com.
About Altera
Altera® programmable solutions enable designers of electronic systems to rapidly and cost effectively innovate, differentiate and win in their markets. Altera offers FPGAs, SoCs, CPLDs, ASICs and complementary technologies, such as power management, to provide high-value solutions to customers worldwide. altera.com
|
Intel FPGA Hot IP
Related News
- Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices
- Fujisoft supports the development of Android-powered embedded devices with the launch of their Graphics Accelerator for Android supporting Altera SoC
- Analog Devices Collaborates With Altera To Streamline Wireless Infrastructure System Development
- Spansion And Saifun Extend License And Development Agreement To Include 4-Bit-Per-Cell Product Design Collaboration
- Altera MAX II Devices Reduce Costs and Increase Manufacturing Flexibility for Leapster L-MAX Handheld
Breaking News
- Arasan's Total MIPI Camera IP solution with CSI and C-PHY achieve ISO26262 Certification
- sureCore announces successful tape-out of cryogenic IP demonstrator
- Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
- UMC Reports Sales for April 2024
- GUC Monthly Sales Report - April 2024
Most Popular
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
- Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip
- Arm Brings Transformers to IoT Devices
- Zhuhai Chuangfeixin: OTP IP Based on 55nm High-Voltage Process Successfully Qualified for Listing
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
E-mail This Article | Printer-Friendly Page |