TSMC Capex to Exceed $10B in FinFET Ramp-Up
Alan Patterson, EETimes
10/16/2014 09:30 AM EDT
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, said Thursday, Oct. 16, that it aims to increase its capital expenditures next year to more than US$10 billion as it accelerates its ramp-up to commercial production of 16 nm FinFET chips.
“Progress is much better than our original plan,” TSMC co-CEO C.C. Wei said at an investor conference to announce the company’s third-quarter 2014 earnings. “Sixteen-nanometer has achieved the best technology and maturity compared to all TSMC’s previous nodes.”
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance