M31 Deploys a Full Range of IP for TSMC 16nm FFC Process
Hsinchu, Taiwan - March 8, 2017 –H.P. Lin, Chairman of M31 Technology today announced that it deploys a full range of silicon IP in TSMC's 16nm FFC (FinFET Compact) process technology. With TSMC's advanced 16nm FFC process technology, M31’s IP solutions help IC customers design cost-effective SoCs with low power consumption, high performance and compact area.
The advanced 16nm FFC process not only enables more IC functions with less space, but also dramatically enhances the circuits by reducing leakage currents. M31 Technology completed the function verification and validation of 16nm FFC High Speed Standard Cell Library in the fourth quarter of 2016. This year M31 continues to develop and enrich its family of high-speed interface silicon IP in 16nm FFC process, including USB, MIPI PHY, PCIe, SATA and others.
Based on the specific characteristics of 16nm, M31 focuses on the development of ultra-high-speed (12-track) standard cell library and low-power/low-voltage operating memory compilers. Utilizing the unique properties of the process, M31 engineering leverages its circuit design and IP development skills in efficiency and low power consumption to enable its customer’s end-user products to be more competitive. In addition, M31 provides a set of ESD IO libraries that are customizable and address special needs for customers designing high-density and high-performance electrostatic protection products.
Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division, said: “The 16nm FFC process is an ideal technology to meet the requirements of power-saving and cost-effective products. It enables our mutual customers to achieve high performance and low power consumption SoC designs."
"M31 Technology has been working closely with TSMC for five years,” said H.P. Lin, Chairman of M31 Technology. "With our unique approach of low-power IP design, M31 has successfully accomplished numerous silicon validated IP in various TSMC platforms, from 180nm to 16nm process. In the latter half of 2017, M31 will provide a full range of verified IP in TSMC 16nm FFC process. Our objective is to be the leader in providing unique silicon IP solutions for the global IC design industry."
|
M31 Technology Corp. Hot IP
- USB 3.2 Gen2/Gen1 PHY IP in TSMC(5nm,6nm, 7nm,12nm/16nm, 22nm, 28nm, 40nm, 55nm)
- PCIe 4.0 PHY in TSMC(6nm,7nm, 12nm,16nm)
- MIPI M-PHY v3.1 IP in TSMC(12/16nm, 28nm, 40nm, and 55nm)
- MIPI D-PHY RX/TX v1.1 / v1.2 IP in TSMC (12/16nm, 28nm, 40nm, and 55nm process)
- SerDes PHY IP in TSMC (7nm, 12/16nm, 22nm, 28nm)
Related News
- M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process
- TSMC plans 1.6nm process for 2026
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- M31 Announces Low-Power IP Solutions for TSMC's N12e Process
- M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
E-mail This Article | Printer-Friendly Page |