Few Surprises as Intel, GloFo Detail Process Technologies
Dylan McGrath, EETimes
12/7/2017 02:01 AM EST
SAN FRANCISCO — Intel detailed plans to use cobalt for some interconnect layers at 10nm, while Globalfoundries offered specifics on how it will utilize extreme ultraviolet (EUV) lithography for the first time at the 7nm node in dueling process technology presentations at one of the most hotly anticipated sessions at the IEEE International Electron Device Meeting (IEDM) here.
Intel will use cobalt in on the bottom two layers of its 10nm interconnect to get a five to 10 fold improvement in electromigration and a two-fold reduction in via resistance. It represents the first time a chip maker has detailed plans to introduce cobalt — a brittle metal long considered a promising dielectric candidate — in a process, according to G. Dan Hutecheson, chairman and CEO of VLSI Research.
E-mail This Article | Printer-Friendly Page |
Related News
- Intel's Roadmap: A Closer Look at Process Technologies and Production Plans
- Samsung and GLOBALFOUNDRIES Forge Strategic Collaboration to Deliver Multi-Sourced Offering of 14nm FinFET Semiconductor Technology
- Intel's Ambitious Process Roadmap
- QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process
- Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance