Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process
Grenoble, France – October 19, 2018 -- The race toward the lowest power consumption and the longest battery life is faster than ever with regards to IoT devices, and particularly for Bluetooth Low Energy and Low Power MCU. SoC architects have defined three main challenges for these autonomous IoT applications:
- reducing leakage to less than 0.5 μA, as IoT devices are sleeping by default
- mastering power consumption during transition time, from sleep to active mode
- reducing dynamic power consumption
To meet these challenges Dolphin Integration has added a new mode to its memory, the Nap mode. This enhanced stand-by mode enables up to 75 % reduction - depending on the instance - of the leakage power with only a single clock cycle wake up time. SpRAM RHEA-LL is ten times less leaky than competition memory and up to 20 % denser. This architecture, already silicon proven in GF® 55 LPe, has been migrated to the GF® 55 LPx process and has already been chosen by one of the biggest US chipset maker.
”The RHEA architecture is one of our flagship SpRAM architectures,” said Frederic Masson, Business Operation Manager at Dolphin Integration. ”We have set an ambitious performance target to provide our customers with crucial differentiating factors in today's competitive market. We reached it”.
About Dolphin Integration
Dolphin Integration, now a registered trademark of Dolphin Design SAS, is an integrated circuit design center and exporter of integrated circuits and components (virtual, analog and digital) for high volume manufacturing. As a major contributor to the emergence of a microelectronics design and following the explosive growth trends in semiconductor design, Dolphin Integration’s mission is to become a global player within the specialized market of service design and optimization of integrated circuits for very low energy consumption. The company's products focus on serving the needs of dynamic consumer and industrial markets such as IoT, mobile, and automotive, as well as those of the European defense design industry.
If you liked reading our announcement please write to us at contact@dolphin.fr or visit us www.dolphin-integration.com
|
Dolphin Design Hot IP
Related News
- Dolphin Integration unveils its ultra-low quiescent-current regulator for IoT Systems-on-Chip at 55 nm
- Dolphin Integration unveils a new generation of low-noise regulators for IoT at 55 nm
- TowerJazz and Dolphin Integration to offer Chip Developers a Complete Solution addressing the Low Power Requirements of the Fast Growing IoT Market
- Audio Codec IP - 40 nm: Dolphin Integration passed TSMC IP9000 Level 4 qualification at Low Power process
- Dolphin Integration sRAM compiler completes TSMC IP9000 Level 1 qualification at 85 nm Ultra Low Power process
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |