CFX Technology partners with Design&Reuse for further implementing IP design and market development
格勒诺布尔,法国, Nov. 20, 2018 –
珠海创飞芯科技和法国Design&Reuse近日开始合作,进一步实施IP设计和市场开发。
珠海创飞芯科技有限公司是一家由清华校友王博士领军的海归博士团队创办的高科技公司,公司聚焦在嵌入式非挥发性存储器IP产品及其基于高可靠非挥发存储器的系统集成与应用。目前公司的产品包括一次可写 (OTP)IP、多次可写(MTP)IP、基于高可靠性存储器的系统集成及其应用,OTP IP 产品已经被上海格科微电子公司、Siltera代工厂等公司广泛应用。基于高可靠的非挥发存储的系统集成产品也将于汽车电子领域得到广泛的应用。清华大学、中国科学院微电子所已入股创飞芯公司,共同开发与推广市场。公司拥有在 OTP、MTP、FPGA、高可靠可穿戴设备等方面的多项中国专利与美国专利,公司自成立以来,公司先后申请多项发明专利与软著。 公司总部坐落在珠海清华科技园,工艺开发与电路设计工作主要在中国科学院微电子研究所进行。
Design and Reuse(D&R)成立于1997年10月,由Gabriele Saucier和Philippe Coeurdevey成立,作为传播电子虚拟组件,特别是IP(知识产权)和SoC(片上系统)的增值信息的门户网站。此后不久,D&R扩大其范围,包括提供企业级知识产权管理平台。
如果您希望了解更多,请点击此处珠海创飞芯科技有限公司
|
Chuangfeixin Technologies Hot IP
Related News
- Edge Impulse and BrainChip Partner to Further AI Development with Support for the Akida platform
- Arm and silicon partners collaborate on IoT development through new Mbed OS Partner Governance model
- Truechip Partners with Advinno to Market Verification IP Products in Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia, Brunei & Cambodia
- SGA Innovations Partners with CEVA to offer a DSP-based Wireline and Wireless Communication Solution for the IoT Market
- Design & Reuse's IP Management Enterprise Platform adds IP-centric revision control front end for targeting IP under development
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |