Intel Says EUV Ready, Challenging
TSMC still requires some double patterning at N7+
By Rick Merritt, EETimes
May 3, 2019
SAN JOSE, Calif. – Extreme ultraviolet (EUV) lithography is “ready for introduction…and running in volume for technology development,” said the head of Intel’s EUV program. But engineers still face several challenges harnessing the complex and costly systems to make leading-edge chips in high volume, she said.
Britt Turkot, a fellow and director of EUV at Intel, said the room-sized systems are running in its giant Portland, Oregon fab. She would not say how or if EUV will be used for the company’s 10nm products ramping now or its planned 7nm node.
Intel was among the semiconductor companies that helped pioneer the technology more than two decades ago, but is among the last to confirm its use. Last year, rival Samsung and TSMC separately announced they were ramping 7nm nodes using EUV systems to print their finest features.
E-mail This Article | Printer-Friendly Page |
Related News
- Intel Says FinFET-based Embedded MRAM is Production Ready
- Intel to place US$14 billion orders with TSMC, says report
- Delay in Mass Production of New Intel Products a Boon for AMD, Proportion of AMD x86 Server CPUs Forecast to Exceed 22% in 2023, Says TrendForce
- Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
- Intel to invest $95bn in Europe over 10 years, says CEO
Breaking News
- Packetcraft Delivers Bluetooth Software Enabling Channel Sounding to Early Access Licensees
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
- Rapid Silicon Introduces Revolutionary Rapid eFPGA Configurator for Hassle Free Embedded FPGA Evaluation
- Silvaco Announces Launch of Initial Public Offering
- Rambus Reports First Quarter 2024 Financial Results