North American Semiconductor Equipment Industry Posts July 2019 Billings
MILPITAS, Calif. — August 22, 2019 — North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in July 2019 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI . The billings figure is 0.4 percent higher than the final June 2019 level of $2.03 billion, and is 14.5 percent lower than the July 2018 billings level of $2.38 billion.
“Total billings of North American equipment manufacturers for July were slightly up over June billings,” said Ajit Manocha, president and CEO of SEMI. “Demand for semiconductor equipment this year is being driven by leading-edge logic and foundry, though memory segment growth is soft due to weak market sentiment.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Period | Billings | Year-Over-Year |
February 2019 | $1,868.1 | -22.7% |
March 2019 | $1,825.3 | -24.9% |
April 2019 | $1,922.0 | -28.5% |
May 2019 | $2,065.2 | -23.6% |
June 2019 (final) | $2.026.1 | -18.4% |
July 2019 (prelim) | $2,034.2 | -14.5% |
Source: SEMI ( www.semi.org ), August 2019
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases . These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo .
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more
|
Related News
- North American Semiconductor Equipment Industry Posts July 2019 Billings
- North American Semiconductor Equipment Industry Posts July 2021 Billings
- North American Semiconductor Equipment Industry Posts July 2020 Billings
- North American Semiconductor Equipment Industry Posts December 2019 Billings
- North American Semiconductor Equipment Industry Posts November 2019 Billings
Breaking News
- Arm revenues up 47%; shares fall
- Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems
- X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
- Softbank reported to be in talks to buy Graphcore
- VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification
Most Popular
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
- Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip
- sureCore announces successful tape-out of cryogenic IP demonstrator
- Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
- Announcing Availability of Silicon-Proven 12bit 1Msps SAR ADC IP Core for Whitebox Licensing with Royalty Free
E-mail This Article | Printer-Friendly Page |