Socionext showcase cutting-edge SoC solutions at Embedded World 2024
February 6, 2024 --- Socionext Europe, a global specialist in customized SoC-based solutions, will grace the halls of Embedded World 2024, Nuremberg 09 - 11 April 2024 | Booth 4A – 628.
The highly anticipated event, renowned as the globe's leading meeting place for the international embedded community, will advance the conversation on embedded systems, focusing on security for electronic systems, distributed intelligence, IoT, and e-mobility.
Socionext seizes this opportunity to showcase its latest innovations, including its ground-breaking 60 GHz radar sensor technology for interior use cases, and to accelerate international networking with a congregation of industry professionals, innovators, and thought leaders.
Visitors will find Socionext's booth conveniently located at Booth 4A - 628, where the company's team will provide live demonstrations of their technology, answer queries, and facilitate engaging discussions.
As the date approaches, Socionext invites attendees of Embedded World 2024 to visit the company's booth to discover the transformative potential of its newest SoC solutions.
|
Socionext Hot IP
Related News
- Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor
- Think Silicon to Showcase its Latest Ultra-Low-Power 3D Graphics and AI in One IP Architecture at Embedded World 2024
- Join Secure-IC at Mobile World Congress 2024 to discover our cutting-edge solutions for mobile and connectivity
- Intrinsic ID to Showcase New Embedded Security Solutions at CES 2024
- Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
E-mail This Article | Printer-Friendly Page |