Rambus Elects Harold Hughes to its Board of Directors
LOS ALTOS, CA -- June 5, 2003 -- Rambus Inc. (Nasdaq:RMBS), a leading provider of chip-to-chip interface products and services, today announced it has elected Harold Hughes to its board of directors. Mr. Hughes brings 26 years of experience in the finance and corporate planning arena to Rambus' board. Mr. Hughes served as a United States Army Officer from 1969 - 1974 before starting his private sector career with Intel Corporation. Mr. Hughes held a variety of positions within Intel Corporation from 1974 - 1997, including treasurer, vice president of Intel Capital, chief financial officer, and vice president of Planning and Logistics. Following Intel, Mr. Hughes was the chairman and CEO of Pandesic LLC, an Intel and SAP joint venture.
"Rambus is an exciting company to be involved with due to the stellar management team and the strong engineering talent," said Harold Hughes. "This unique combination allows Rambus to create the world's fastest chip-to-chip interface solutions and deliver these solutions to the market."
In addition to serving on Rambus' board, Mr. Hughes also serves on the boards of London Pacific, Merant, and Atsana. Mr. Hughes holds a BA from the University of Wisconsin and an MBA from the University of Michigan.
About Rambus Inc.
Rambus is a leading provider of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging I/O problems and bring industry-leading products to market. Rambus' interface solutions can be found in numerous computing, consumer electronic and networking. Additional information is available at www.rambus.com
|
Related News
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |