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Deals / Success Stories News

• Chips&Media was reportedly signed a contract to supply ISP IP package for IP cameras intended for surveillance market (Monday Mar. 26, 2018)
  Chips&Media was reportedly signed a contract with one of major SoC manufacturer in Asia to license Image Signal Processing (ISP) IPs for intended use in surveillance cameras.
  
  
• Secure Provisioning Solutions from Inside Secure Now Protecting Pay TV Services at Kiwisat (Monday Mar. 26, 2018)
  Inside Secure today announced that Kiwisat Corporation, a leading provider of satellite HDTV content in the Caribbean, is going into production using Inside Secure’s leading Secure Provisioning Solution and Content Protection Solution to protect Kiwisat content from video pirates.
  
  
• Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd. (Tuesday Mar. 20, 2018)
  Rambus Inc. (NASDAQ: RMBS) today announced that it has signed a patent license agreement with Beijing Tongfang Microelectronics Co., Ltd., a fabless chip design company focusing on smart cards and related technologies.
  
  
• HiTrend selects Dolphin Integration's cache controller for its next generation of smart energy metering chips (Monday Mar. 19, 2018)
  HiTrend leads the domestic smart meter IC industry with its analog and digital technologies. It created a series of energy metering IC products, as well as power line carrier communication IC products. Its Energy Metering ICs are based on Cortex-M0 ARM micro controller with Flash/SRAM memories. To achieve performance and low power, HiTrend has opted to combine the Cortex-M0 with Dolphin Integration’s R-STRATUS-LP cache controller.
  
  
• Silicon Creations' PMA Technology Part of Microsemi Award-Winning FPGA (Friday Mar. 16, 2018)
  Silicon Creations announced that its multi-protocol serializer/deserializer (SerDes) transceiver Physical Medium Attachment (PMA) intellectual property (IP) was part of Microsemi Corporation’s PolarFire field programmable gate array (FPGA), named 2017 “Product of the Year” by Electronics Products magazine, as well as the Electronic Products China/21ic.com 2017 “Product of the Year.”
  
  
• Arteris IP FlexNoC Interconnect Licensed by VeriSilicon for Multiple Chip Designs (Tuesday Mar. 13, 2018)
  Arteris IP today announced that VeriSilicon Holdings Co., Ltd. (VeriSilicon) has purchased multiple licenses of Arteris FlexNoC interconnect IP for use as the on-chip communications backbone of SoCs for the data center, automotive and other applications.
  
  
• Mnano selects Dolphin Integration's six-channel Audio converter for its next generation of Smart Speakers (Monday Mar. 12, 2018)
  Fabless provider and market leader Mnano, has chosen Dolphin Integration for its innovative generation of multi-channel audio A/D Converter, YANZI-A-hexADC-VD.01, which combines an embedded Voice Activity Detector with a complete set of audio features.
  
  
• Wave Computing Adopts Low Power MIPS 64-bit Multi-Threaded Core (Wednesday Mar. 07, 2018)
  Wave Computing™, the Silicon Valley company that is revolutionizing artificial intelligence (AI) and deep learning with its dataflow-based solutions, announced today that it has selected a 64-bit Multi-Threaded processor core from MIPS Technologies for future AI solutions.
  
  
• GCT Semiconductor Licenses CEVA Bluetooth Low Energy IP for its LTE IoT SoC (Wednesday Mar. 07, 2018)
  CEVA today announced that GCT Semiconductor, Inc., (GCT) a leading designer and supplier of advanced 4G mobile semiconductor solutions, has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy (BLE) IP in its new GDM7243i LTE SoC solution for the Internet of Things (IoT).
  
  
• M31 and Macroblock work together to deploy the global LED driver IC market (Wednesday Mar. 07, 2018)
  M31 Technology and Macroblock today announced to establish their long-term partnership. Macroblock will continue adopting M31’s unique low-power IP solutions for its development of LED Driver IC to actively deploy various LED display screens and LED lighting markets in the world.
  
  
• Canaan-Creative employs Moortec's Temperature Sensor in their new ASIC aimed at HPC IC (Monday Mar. 05, 2018)
  Moortec, providers of In-Chip Monitoring PVT Subsystems solutions are pleased to announce that Canaan-Creative have employed Moortec’s In-Chip Monitoring Subsystem in their HPC IC.
  
  
• GOWIN Semiconductor selects PLDA XpressRICH3 Controller IP as the PCIe interface block in their FPGA product line (Wednesday Feb. 28, 2018)
  PLDA®, the industry leader in PCI Express® interface IP solutions, today announced that GOWIN Semiconductor, a leading semiconductor company in China, has chosen PLDA’s PCIe ASIC IP for their upcoming FPGA product line. GOWIN offers a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits.
  
  
• Trinamic Licenses Codasip's Bk3 RISC-V Processor for Next Generation Motion Control Applications (Wednesday Feb. 28, 2018)
  Trinamic, the global leader in embedded motor and motion control, has selected Codasip's Bk3 processor for their next designs. The Bk3 is based on the open and flexible RISC-V architecture.
  
  
• Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development (Tuesday Feb. 27, 2018)
  Arteris IP today announced that Chinese automotive semiconductor vendor AutoChips has licensed Arteris FlexNoC interconnect IP as the on-chip communications backbone of its next-generation automotive SoC chip.
  
  
• GEO Semiconductor Selects Cadence Tensilica Vision P5 DSP for Their Most Advanced Automotive Smart Viewing Camera Processor (Monday Feb. 26, 2018)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that GEO Semiconductor (GEO) selected the Cadence® Tensilica® Vision P5 DSP for GEO’s new GW5400 camera video processor.
  
  
• Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio (Monday Feb. 26, 2018)
  Global communications equipment provider Huawei has entered into a worldwide patent license agreement with the renowned developer of audio and media technologies, Fraunhofer IIS, for Fraunhofer's MPEG-4 Audio patent portfolio.
  
  
• Inside Secure to Provide Secure Provisioning Solutions to ALi Corporation (Monday Feb. 26, 2018)
  Inside Secure today announces that they have entered into an agreement with ALi Corporation to use Inside Secure’s leading Secure Provisioning Solution to build robust security into its products during the chip manufacturing process.
  
  
• Ceragon License CEVA DSPs for Full 5G Wireless Backhaul (Monday Feb. 26, 2018)
  CEVA today announced that Ceragon Networks Ltd. (NASDAQ: CRNT) has licensed the CEVA-X2 and CEVA-XC4500 DSPs to deploy in a new software-defined radio modem which is being designed to address the mature stage of 5G service network rollout.
  
  
• WuQi Technologies is the latest licensee of CCww's NB-IoT UE protocol-stack software (Thursday Feb. 22, 2018)
  Communications Consultants Worldwide Ltd. (CCww), global innovator of 3GPP® technologies, has licensed its NB-IoT protocol-stack software to WuQi Technologies Inc., a leading global developer of highly integrated mixed-signal SoC solutions, and the latest licensee of CCww’s NB-IoT Release 13 UE protocol-stack software.
  
  
• Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks (Thursday Feb. 15, 2018)
  Rambus today announced that it has signed a patent license agreement with Gemalto. The agreement covers the use of Rambus patents covering Differential Power Analysis (DPA) Countermeasures, which protect devices and integrated circuits against DPA and other related side-channel attacks.
  
  
• Arteris IP FlexNoC Interconnect Licensed by Arbe Robotics for Automotive Imaging Radar Chipset (Wednesday Feb. 14, 2018)
  Arteris IP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect intellectual property (IP), today announced that Arbe Robotics has licensed Arteris FlexNoC interconnect IP for use in their 4D High-resolution Automotive Radar chipset.
  
  
• Solid State System Co., Ltd. selects Andes AndesCore N9 for Its SSS6131 USB 3.1 Gen 1 Flash Controller Highly Demand for Storage Application (Wednesday Feb. 14, 2018)
  Andes Technology Corporation, the leading Asia-based supplier of small, low-power, high performance 32/64-bit embedded CPU cores, today announced that Solid State System Co., Ltd. (3S) has licensed the mid-range AndesCore™ N903A for the SSS6131 USB 3.1 Gen 1 flash controller chip.
  
  
• Sonics NoC Customer Starblaze Technology Reaches Volume Production With STAR1000 SSD Controller SoC (Tuesday Feb. 06, 2018)
  Sonics announced that its Chinese customer, Starblaze Technology, has reached volume production in TSMC’s 28HPC process technology with the STAR1000 solid state storage device (SSD) controller system-on-chip (SoC).
  
  
• Horizon Robotics Licenses NetSpeed Interconnect IP for AI SoCs (Tuesday Jan. 30, 2018)
  NetSpeed Systems, Inc. today announced that Horizon Robotics has licensed NetSpeed Orion and Gemini Interconnect IP for use in its industry-leading artificial intelligence (AI) chips for embedded AI applications such as autonomous driving and smart cameras.
  
  
• Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology (Monday Jan. 22, 2018)
  Flex Logix™ Technologies, Inc., today announced that its embedded FPGA technology will be used by a consortium of Israeli semiconductor and systems companies including Mellanox, Satixfy, DSP Group and AutoTalks under a license with Bar Ilan’s SoC Lab which is part of the HiPer Consortium.
  
  
• Starblaze Reaches Volume Production with Moortec's Temperature Sensor in their SSD Controller SoC (Monday Jan. 22, 2018)
  Moortec today announced that Starblaze Technology have employed Moortec’s 28nm Temperature Sensor IP in their STAR1000 high-end consumer and starter enterprise SSD controller which has recently reached volume production.
  
  
• Inside Secure Protects New Interactive Video Application Developed by PodOp and HBO (Monday Jan. 22, 2018)
  Inside Secure today announces that its Content Protection Solution has been chosen by PodOp, an innovative media technology company, to secure its streaming services solution used in the interactive Android application for MOSAIC, an HBO production directed by industry luminary Steven Soderbergh and starring Sharon Stone.
  
  
• ASR License CEVA DSP and Connectivity Technologies for Smartphones and IoT Devices (Wednesday Jan. 17, 2018)
  CEVA today announced that ASR Microelectronics (Shanghai) Co., Ltd., has licensed multiple CEVA technologies for its upcoming system-on-chip (SoC) products for smartphones and narrowband IoT (NB-IoT) edge devices.
  
  
• eSilicon announces 7nm FinFET ASIC design win (Tuesday Jan. 09, 2018)
  eSilicon today announced its first 7nm design win at a major OEM. The design win follows eSilicon’s development of a complete IP platform on TSMC 7nm process technology for high-bandwidth networking, high-performance computing and AI applications.
  
  
• Arteris IP FlexNoC Interconnect Licensed by Nationz Technologies for Ultra-Low Power Security IoT Chips (Tuesday Jan. 09, 2018)
  Arteris IP today announced that Chinese secure IoT device leader Nationz Technologies has licensed Arteris IP FlexNoC interconnect IP for use in ultra-low power IoT chips that enable trusted services.