Foundries News

• MEMSensing Launches the World's Smallest Commercial 3-Axis Accelerometer MSA330 with SMIC (Monday Jan. 05, 2015)
  MEMSensing and SMIC jointly announced the launch of the world's smallest 3-axis accelerometer MSA330, which utilizes SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.
  
  
• SMIC Announces Co-investment Agreement and Investment Exit Agreement in Relation to Proposed Acquisition (Monday Dec. 22, 2014)
  
  
  
• SMIC Successfully Produces Qualcomm Snapdragon 410 processor in 28nm Process (Thursday Dec. 18, 2014)
  SMIC and Qualcomm today announced that its subsidiary, Qualcomm Technologies, Inc., and SMIC have achieved a major milestone in fabrication of 28nm Qualcomm® Snapdragon™ 410 processors.
  
  
• GLOBALFOUNDRIES and Cadence Deliver First SoC Enablement Solution Featuring ARM Cortex-A17 Processor in 28nm-SLP Process (Wednesday Dec. 17, 2014)
  Cadence and GLOBALFOUNDRIES today announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GLOBALFOUNDRIES’ 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology.
  
  
• SMIC's Shenzhen Fab Goes into Operation (Wednesday Dec. 17, 2014)
  SMIC announced today it has begun operations at its Shenzhen 200mm wafer fab. This fab is the first 8-inch production line to be put into operation in Southern China, and is also the first domestic IC production line to be launched after the 'National Outline of Promoting the Development of IC Industry' was issued this year.
  
  
• Infineon and UMC Announce Manufacturing Agreement for Automotive Applications (Monday Dec. 15, 2014)
  Infineon Technologies and UMC today announced the extension of their manufacturing partnership into power semiconductors for automotive applications.
  
  
• TowerJazz Announces Successful Transfer of Fairchild Semiconductor’s Discrete Devices to TowerJazz Panasonic Semiconductor’s Japan Fab (Wednesday Dec. 10, 2014)
  TowerJazz announced today that Fairchild Semiconductor has started mass production at TowerJazz Panasonic Semiconductor Co.’s (TPSCo’s) fabrication facility in Tonami, Japan. This is a process transfer from Fairchild of their state of the art discrete devices for the industrial and consumer markets.
  
  
• Intel Custom Foundry Demonstrates Industry-Leading 32 Gbps SerDes on 14nm Process (Wednesday Nov. 19, 2014)
  Intel Corporation today unveiled silicon characterization results for its 1 to 32 Gbps high-speed SerDes on the 14nm process. This 32 Gbps SerDes is the second SerDes offering and adds to the previously announced 1 to 16 Gbps GP 14nm SerDes. It will be available by end of this year.
  
  
• TSMC 16FinFET Plus Process Achieves Risk Production Milestone (Wednesday Nov. 12, 2014)
  TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC’s 16FF process operates 40% faster than the company’s planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed.
  
  
• GLOBALFOUNDRIES and INVECAS Introduce New Dedicated Design Service Partner for Leading-Edge Technologies (Friday Nov. 07, 2014)
  GLOBALFOUNDRIES today announced a partnership with INVECAS Inc., a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.
  
  
• UMC Enters Volume Production for Lantiq's Communication ICs (Tuesday Oct. 28, 2014)
  UMC today announced that UMC has entered volume production for Lantiq’s SPT170 high voltage Power Management ICs (PMIC) used for landline applications.
  
  
• Everspin and GLOBALFOUNDRIES partner to supply fully processed 300mm CMOS wafers with Everspin's ST-MRAM technology (Tuesday Oct. 28, 2014)
  Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded MRAM, today announced that the company has partnered with GLOBALFOUNDRIES to build fully processed 300mm wafers with Everspin’s magnetic tunnel junction (MTJ) Spin-Torque Magnetoresistive Random-Access Memory (ST-MRAM) technology, starting with GLOBALFOUNDRIES 40 nanometer and 28 nanometer Low Power CMOS platforms.
  
  
• SMIC and ASML Sign a Volume Purchase Agreement Worth 450 Million Euros (Monday Oct. 27, 2014)
  SMIC and ASML announce the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML. The VPA which is worth approximately 450 million Euros and is part of a strategic partnership between the companies that will help facilitate the timely expansion of SMIC's advanced technology capacities.
  
  
• UMC Board Resolves to Enter a Joint Venture Agreement for a 12" Fab in China (Thursday Oct. 09, 2014)
  The Board of Directors of UMC today resolved to participate in a 3-way agreement for a joint venture company focused on 12" wafer foundry services with Xiamen Municipal People's Government and FuJian Electronics & Information Group.
  
  
• TSMC launches ultra-low power technology platform for IoT and wearable device applications (Monday Sep. 29, 2014)
  TSMC today announced the foundry segment’s first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications.
  
  
• TSMC delivers first fully functional 16FinFET networking processor (Thursday Sep. 25, 2014)
  TSMC today announced that its collaboration with HiSilicon Technologies Co, Ltd. has successfully produced the foundry segment’s first fully functional ARM-based networking processor with FinFET technology.
  
  
• TSMC 28HPC Process in Volume Production (Friday Sep. 12, 2014)
  TSMC today announced its 28-nanometer High Performance Compact (28HPC) process is in volume production, making it the most power- and cost-efficient solution among all 28-nanometer technologies in the foundry segment.
  
  
• SMIC Introduces Independently Developed 38nm NAND Process Technology (Wednesday Sep. 10, 2014)
  SMIC announced the readiness of 38nm NAND Flash process technology, making it the only foundry to manufacture NAND products for its customers. This process platform has been independently developed in its entirety by SMIC.
  
  
• QuickLogic and GLOBALFOUNDRIES Collaborate to Deliver Next-Generation Sensor Hub for Smartphones and Wearables (Tuesday Sep. 09, 2014)
  QuickLogic and GLOBALFOUNDRIES today announced that QuickLogic’s next-generation ArcticLink 3 S2 Ultra-low Power Sensor Hub is sampling on GLOBALFOUNDRIES’ low-power 65nm process technology.
  
  
• NJR Analog ICs Manufactured at UMC Adopted by Major Japanese Auto OEM (Wednesday Sep. 03, 2014)
  New Japan Radio Co., Ltd. (New JRC) and UMC today announced that they have begun supplying automotive ICs to major Tier-1 Japanese auto suppliers.
  
  
• UMC Joins Fujitsu's New Foundry Company (Friday Aug. 29, 2014)
  UMC and Fujitsu Semiconductor today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan. UMC’s advanced 40nm technology will be also licensed to Fujitsu Semiconductor.
  
  
• Himax Imaging chooses TowerJazz Panasonic Semiconductor's State of the Art 65nm process with Outstanding 1.12µm Pixel for its Next Generation Cameras for Smart Phone Applications (Thursday Aug. 28, 2014)
  TowerJazz and TowerJazz Panasonic Semiconductor today announced its first major third party CMOS image sensor (CIS) customer, Himax Imaging, that is developing its next generation high end cameras for smart phone applications using TPSCo's state of the art 1.12µm-pixel CMOS image sensor (CIS) 65nm process.
  
  
• Intel Outlines 14nm, Broadwell (Tuesday Aug. 12, 2014)
  Intel provided the first details of its 14nm process technology, now qualified for volume production in an Oregon fab, and gave a sneak peak at Broadwell, its first CPU to use it.
  
  
• SMIC and JCET Establish a Joint Venture in Jiangyin National High-Tech Industrial Development Zone (Friday Aug. 08, 2014)
  SMIC and JCET jointly announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.
  
  
• NJR and UMC Extends Collaboration to MEMS Microphone Manufacturing (Wednesday Aug. 06, 2014)
  New Japan Radio Co., Ltd. (New JRC) and United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR’s MEMS (micro electro mechanical system) microphone products.
  
  
• HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform (Monday Aug. 04, 2014)
  SMIC and HED jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform.
  
  
• Intel's Custom Foundry Will Manufacture Future Panasonic System-on-Chips Using Intel's 14nm Low-Power Process (Tuesday Jul. 08, 2014)
  Intel today announced that it has entered into a manufacturing agreement with Panasonic Corporation’s System LSI Business Division. Intel’s custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel’s 14nm low-power manufacturing process.
  
  
• SMIC and Qualcomm Collaborate on 28nm Wafer Production in China (Thursday Jul. 03, 2014)
  SMIC and Qualcomm have announced that SMIC and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, are working together in connection with 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm® Snapdragon™ processors.
  
  
• SMIC Establishes the First 12 inch CIS Supply Chain in China (Tuesday Jun. 24, 2014)
  SMIC, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter & micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics (Shanghai) Co., Ltd. ("TSES"), a joint venture of SMIC and Toppan Printing Co., Ltd. ("Toppan").
  
  
• SMIC and Brite Creates New Network Platform SMIC-ASIC.com (Thursday Jun. 05, 2014)
  Established by Brite and supported by SMIC and Brite, the key purpose of the platform is to build a professional network community in the semiconductor industry. SMIC-ASIC.com has multiple functions, ranging from the delivery of ASIC information, to supporting engineering, technical and business related enquires.