Foundries News

• Scaleo chip and GLOBALFOUNDRIES Announce First Automotive MCU Manufactured Using 55nm Automotive-Specific Semiconductor Platform (Wednesday Jun. 04, 2014)
  Scaleo chip today announced that they are the first fabless company to introduce an automotive microcontroller manufactured with the new GLOBALFOUNDRIES 55nm automotive-specific advanced semiconductor manufacturing platform.
  
  
• Samsung's 14nm FinFET Process Technology Ecosystem Solidly in Place for Mobile Consumer and IT Infrastructure SoC Applications (Monday Jun. 02, 2014)
  Stating that not all FinFETs are created equal, Samsung Electronics Co., Ltd., a global leader in advanced semiconductor solutions, today announced that the IP and design enablement ecosystem for its foundry’s 14nm FinFET process technology is firmly in place as customers begin their early design work.
  
  
• SMIC Offers Stable and Robust Wafer Productions for Fingerprint Sensors (Tuesday May. 20, 2014)
  SMIC today announced that the company has ramped up wafer productions for fingerprint sensors with stable and robust solutions. Fingerprint sensor is the key device of fingerprint identification and automatic collection.
  
  
• SMIC and Other Groups Collaborate to Setup the "IC Advanced Technology Research Institute" to Put Research Into the Fast Lane (Friday May. 16, 2014)
  SMIC today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.
  
  
• Samsung and STMicroelectronics Sign Strategic Agreement to Expand 28nm FD-SOI Technology (Thursday May. 15, 2014)
  STMicroelectronics and Samsung Electronics today announced the signing of a comprehensive agreement on 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) technology for multi-source manufacturing collaboration.
  
  
• ON Semiconductor Introduces New Qualified IP Blocks on its 180 nm Process Leading to Reduced Time to Market (Friday May. 09, 2014)
  ON Semiconductor has announced the availability of new qualified intellectual property (IP) on its proprietary ONC18 180 nanometer (nm) process technology. The newly qualified circuit blocks will help ON Semiconductor’s foundry (GDS2) interface customers minimize the risk of the need for silicon re-spins and therefore help reduce development costs and shorten time-to-market for new designs.
  
  
• UMC Reports Sales for April 2014 (Friday May. 09, 2014)
  UMC today reported unaudited net sales for the month of April 2014.
  
  
• GLOBALFOUNDRIES Introduces 55nm Automotive-Specific Advanced Semiconductor Manufacturing Platform (Wednesday May. 07, 2014)
  Built on the company’s 55-nanometer (nm) Low Power process and AEC-Q100 Group D qualified, the solution includes a comprehensive set of technology and design enablement capabilities tailored to improve the efficiency, performance, and power consumption of automotive ICs while maintaining adherence to the industry’s strict safety and quality standards.
  
  
• Toshiba Joins GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner (Tuesday Apr. 22, 2014)
  GLOBALFOUNDRIES today announced that Toshiba Corporation will join the company’s GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSATM) and ASIC solutions based upon GLOBALFOUNDRIES’ technologies and services for customers across the globe.
  
  
• Samsung and GLOBALFOUNDRIES Forge Strategic Collaboration to Deliver Multi-Sourced Offering of 14nm FinFET Semiconductor Technology (Thursday Apr. 17, 2014)
  Samsung Electronics Co., Ltd. and GLOBALFOUNDRIES today announced a new strategic collaboration to deliver global capacity for 14 nanometer (nm) FinFET process technology. For the first time, the industry’s most advanced 14nm FinFET technology will be available at both Samsung and GLOBALFOUNDRIES, giving customers the assurance of supply that can only come from true design compatibility at multiple sources across the globe.
  
  
• TSMC to Sell 5% of Vanguard International Semiconductor (Friday Apr. 11, 2014)
  The TSMC Board of Directors today approved the sale of 82 million common shares of Vanguard International Semiconductor Corporation (VIS), approximately 5% of VIS’ paid-in-capital, at a price of about NT$42.55 per share and a total price of approximately NT$3.49 billion.
  
  
• Common Platform in Preparation for SOI, FinFETs at 10nm (Wednesday Apr. 09, 2014)
  A team of engineers from IBM Microelectronics, Globalfoundries, Samsung, STMicroelectronics and UMC are due to present a 10nm logic platform that supports FinFETs on both bulk CMOS and on silicon-on-insulator wafers.
  
  
• AMD Amends Wafer Supply Agreement with GLOBALFOUNDRIES (Thursday Apr. 03, 2014)
  AMD today announced that it amended its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. for 2014. Under the terms of the amendment, AMD and GLOBALFOUNDRIES agreed on purchase commitments for 2014 and established fixed pricing and other terms of the WSA which apply to products AMD will purchase from GLOBALFOUNDRIES.
  
  
• Intel Custom Foundry Demonstrates Industry-Leading General Purpose SerDes on 14nm Process (Tuesday Mar. 25, 2014)
  Intel Corporation today demonstrated silicon results for its 1 to 16 Gbps 14nm general purpose SerDes (Serializer Deserializer). This 14nm SerDes is first in a family of SerDes that will include industry-leading 10 to 32 Gbps high-speed SerDes and 1 to 10 Gbps low-power SerDes.
  
  
• SMIC Offers a Full Set of ESD Protection Service to Enhance the Whole Chip ESD Design for Customers (Tuesday Mar. 25, 2014)
  SMIC announced today that a full set of Electrostatic Discharge (ESD) protection service, including documents, checklists, PERC Suite, floor plan review, and risk management services, has been offered to IC design customers to enhance the whole chip ESD design and ensure their first silicon success.
  
  
• GloFo Shows Progress in 3D Stacks (Thursday Mar. 20, 2014)
  GlobalFoundries will describe, in May, a way to make 3D chip stacks without a large keep-out zone around its through-silicon vias. The work is being hailed as an advance in silicon integration at a time when Moore's Law is slowing getting more costly.
  
  
• Samsung Proliferates the Internet of Things with the Addition of RF Capabilities to its 28nm Process Technology for Foundry Customers (Friday Mar. 07, 2014)
  Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities. As the Internet of Things quickly becomes a reality, Samsung’s foundry business offers chip designers the ability to integrate advanced RF functionality into their designs, making connectivity applications such as the connected home appliances, auto infotainment systems and heating/cooling systems possible.
  
  
• SMIC and JCET Establish a Joint Venture to Build China's Local IC Manufacturing Supply Chain (Thursday Feb. 20, 2014)
  SMIC and JCET, the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing. JCET will also build advanced back-end package production lines nearby.
  
  
• Synopsys, Realtek and UMC Collaborate on Industry's First Single-Chip Ultra High Definition Smart TV SoC (Wednesday Feb. 12, 2014)
  Synopsys, Realtek and UMC today announced that their collaboration has resulted in first-pass silicon success of Realtek’s RTD2995 UHD Smart TV Controller SoC implemented in UMC’s 40LP, the foundry’s volume production, low-power 40-nanometer (nm) process technology.
  
  
• ARM and SMIC Broaden IP Partnership with 28nm Process for Mobile and Consumer Applications (Monday Feb. 10, 2014)
  ARM and SMIC today announced an agreement to offer the ARM® Artisan® physical IP platform for SMIC's 28nm poly SiON (PS) process to provide high-performance, high-density and low-power technologies for SoC designs.
  
  
• SMIC Unveils 28nm Readiness and MPW Milestone (Monday Jan. 27, 2014)
  SMIC announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer (MPW) stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate (HKMG) processes.
  
  
• Dual-interface Financial IC Card Chip Based on SMIC's eEEPROM Platform Gains CC EAL4+ Certification (Wednesday Jan. 22, 2014)
  SMIC and SHHIC both announced today the dual-interface financial IC card chip based on SMIC's eEEPROM platform has passed CC EAL4+ certification. SHHIC's SHC1302/2907M4 is the first and only Chinese domestic designed IC to obtain this security certification which is the most recognized in the international IT field.
  
  
• ARM and UMC Extend 28nm IP Partnership to Target Cost-Effective Mobile and Consumer Applications (Tuesday Jan. 14, 2014)
  ARM and UMC today announced an agreement to offer the ARM® Artisan® physical IP platform along with POP™ IP for UMC’s 28nm high-performance low-power (HLP) process technology.
  
  
• UMC Surpasses 15 Million Shipments for Customer 55nm SDDI Chips (Tuesday Jan. 07, 2014)
  UMC today announced that it has surpassed 15 million shipments for customer small display driver ICs (SDDI) manufactured using the foundry’s 55nm embedded high voltage (eHV) technology. The 55nm eHV process, utilized by customers to enable high-end, high-resolution smartphones, is being produced with excellent manufacturing yields in the foundry’s 300mm fabs in Taiwan and Singapore.
  
  
• GLOBALFOUNDRIES Demonstrates Collaborative Model for Next-Generation Chip Packaging Technologies (Friday Nov. 22, 2013)
  GLOBALFOUNDRIES today unveiled details of a project that demonstrates the value of its open and collaborative approach to delivering next-generation chip packaging technologies.
  
  
• Open-Silicon and GLOBALFOUNDRIES Demonstrate Custom 28nm SoC Using 2.5D Technology (Friday Nov. 22, 2013)
  Open-Silicon and GLOBALFOUNDRIES today announced the industry's first demonstration of a functional SoC solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.
  
  
• Peregrine and GLOBALFOUNDRIES Collaborate to Advance RF SOI Technology (Wednesday Oct. 30, 2013)
  Peregrine Semiconductor and GLOBALFOUNDRIES are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies.
  
  
• SMIC Announces Formation of Center for Vision, Sensors and 3DIC (Tuesday Oct. 22, 2013)
  SMIC announced today the formation of SMIC's Center for Vision, Sensors and 3DIC (CVS3D).
  
  
• SMIC Offers Differentiated 0.13um Low-Leakage Embedded Flash Manufacturing Process (Tuesday Oct. 15, 2013)
  SMIC announced today its 0.13um Low-Leakage (LL) embedded Flash (eFlash) process has entered volume production stage. SMIC's 0.13um LL eFlash technology is a continuation of SMIC's Non-Volatile Memory (NVM) offering to provide customers a differentiated solution to address performance, power consumption and cost.
  
  
• Bank Card IC Products Adopting SMIC eEEPROM Platform Certified by China Union Pay (Tuesday Oct. 08, 2013)