Foundries News

• GLOBALFOUNDRIES Announces Industry-Leading GF SHIELD Program to Further Safeguard Customer Data and IP (Monday Sep. 28, 2020)
  GLOBALFOUNDRIES announced today the deployment of GF SHIELD, a comprehensive, company-wide platform to further safeguard and protect its customers’ intellectual property and products.
  
  
• GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility (Monday Sep. 28, 2020)
  GLOBALFOUNDRIES announced today the next generation of its FDXTM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices.
  
  
• SkyWater Begins Domestic Fab Expansion Tool Installation to Support DOD Investment of up to $170M (Thursday Sep. 10, 2020)
  SkyWater Technology, the only solely U.S.-owned pure-play foundry, today announced that its facility expansion, supported by the previously announced Department of Defense (DOD) investment of up to $170 million, is progressing ahead of schedule and tool installation has already started.
  
  
• Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology (Tuesday Aug. 25, 2020)
  Marvell's breakthrough 5nm portfolio will provide the essential high-performance compute, networking and security technology required to advance infrastructure development for a multitude of end-market applications.
  
  
• GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit (iPDK) Support for 22FDX (Wednesday Jul. 22, 2020)
  GLOBALFOUNDRIES® (GF®) today announced the release and distribution of OpenAccess iPDK libraries optimized for its 22FDX® (22nm FD-SOI) platform.
  
  
• Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform (Monday Jul. 20, 2020)
  Hua Hong Semiconductor announced that its 95nm SONOS (Silicon Oxide Nitride Oxide Silicon) embedded non-volatile memory (eNVM) process platform has further enhanced its technological advantages and greatly improved its reliability through continuous innovation and upgrading.
  
  
• Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices (Thursday Jul. 09, 2020)
  Based on imec’s Analog in Memory Computing (AiMC) architecture utilizing GF’s 22FDX® solution, the new chip is optimized to perform deep neural network calculations on in-memory computing hardware in the analog domain.
  
  
• Soitec announces POI substrates business agreement with Qualcomm Technologies for 5G RF filters (Wednesday Jul. 08, 2020)
  Soitec (Euronext Paris), an industry leader in designing and manufacturing innovative semiconductor materials, announced today a business agreement with Qualcomm Technologies, Inc. on the supply of piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters.
  
  
• Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production (Tuesday Jun. 30, 2020)
  GF’s differentiated 12LP+ solution is optimized for artificial intelligence (AI) training and inference applications. Built on a proven platform with a robust production ecosystem, 12LP+ offers chip designers an efficient development experience and a fast time-to-market.
  
  
• GLOBALFOUNDRIES to Acquire Land in Malta, NY, Positioning its Advanced Manufacturing Facility for Future Growth (Monday Jun. 22, 2020)
  GLOBALFOUNDRIES® (GF®), today announced it has secured a purchase option agreement for approximately 66 acres of undeveloped land adjacent to its most advanced manufacturing facility, Fab 8, in Malta, N.Y., near the Luther Forest Technology Campus (LFTC).
  
  
• GLOBALFOUNDRIES and SkyWater Technology Sign MOU for Technology Development to Strengthen Domestic Supply Assurance for U.S. Government (Friday Jun. 19, 2020)
  GLOBALFOUNDRIES® (GF®) and SkyWater Technology today announced the companies have signed a Memorandum of Understanding (MOU) to manufacture secure solutions for the U.S. defense industrial base and cooperate on development of emerging technologies.
  
  
• Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform" (Thursday Jun. 18, 2020)
  Samsung Electronics today announced the launch of ‘Samsung Advanced Foundry Ecosystem (SAFE™) Cloud Design Platform (CDP)’ for fabless customers, in collaboration with Rescale, a leader in high performance computing (HPC) applications in the cloud.
  
  
• NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform (Friday Jun. 12, 2020)
  NXP Semiconductors N.V. (NASDAQ: NXPI) and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform.
  
  
• SkyWater Licenses Key FDSOI Technology from MIT Lincoln Laboratory, Moves Up Availability of its 90 nm Strategic Rad-Hard by Process Offering (Thursday Jun. 11, 2020)
  SkyWater Technology announced it has licensed MIT Lincoln Laboratory’s 90 nanometer (nm) fully depleted silicon-on-insulator (FDSOI) complementary metal-oxide-semiconductor (CMOS) process to produce radiation-hardened (rad-hard) electronics which can withstand harsh radiation environments.
  
  
• TSMC Delivers World-first 7nm Automotive Design Enablement Platform (Thursday May. 28, 2020)
  TSMC today announced the availability of the world’s first 7nm Automotive Design Enablement Platform (ADEP), accelerating time-to-design for customers’ AI Inferencing Engines, Advanced Driver-assistance Systems (ADAS) and Autonomous Driving applications.
  
  
• TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States (Friday May. 15, 2020)
  TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.
  
  
• GLOBALFOUNDRIES Dresden Certified to Manufacture Secure Products (Monday Apr. 27, 2020)
  The German Federal Office for Information Security (Bundesamt für Sicherheit in der Informationstechnik, BSI) has certified the GLOBALFOUNDRIES® (GF®) Dresden site according to the latest international Common Criteria standard (ISO 15408, CC Version 3.1).
  
  
• MagnaChip Semiconductor Announces Definitive Agreement To Sell Foundry Business and Fab 4 (Wednesday Apr. 01, 2020)
  MagnaChip today announced that certain of its wholly-owned subsidiaries have entered into a definitive agreement to sell the Company's Foundry Services Group and the factory in Cheongju ("Fab 4"), the larger of the Company's two 8" manufacturing facilities (collectively, the "Target Business"), to a special purpose company (the "SPC") in South Korea established by Alchemist Capital Partners Korea Co., Ltd. ("Alchemist") and Credian Partners, Inc. ("Credian", and together with Alchemist, "AC Consortium").
  
  
• TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer (Tuesday Mar. 03, 2020)
  With an area of approximately 1,700mm2, this next generation CoWoS interposer technology significantly boosts computing power for advanced HPC systems by supporting more SoCs as well as being ready to support TSMC’s next-generation five-nanometer (N5) process technology.
  
  
• GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications (Thursday Feb. 27, 2020)
  GLOBALFOUNDRIES® (GF®) today announced its embedded magnetoresistive non-volatile memory (eMRAM) on the company’s 22nm FD-SOI (22FDX®) platform has entered production, and GF is working with several clients with multiple production tape-outs scheduled in 2020.
  
  
• GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers (Monday Feb. 24, 2020)
  GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and GlobalWafers Co., Ltd. (GWC), one of the top three silicon wafer manufacturers in the world, today announced they have signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300mm silicon-on-insulator (SOI) wafers.
  
  
• STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products (Thursday Feb. 20, 2020)
  STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market.
  
  
• UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow (Wednesday Feb. 05, 2020)
  UMC today announced that the company has certified its 14nm process on the Calibre™ Eco Fill tape-out flow utility from Mentor, a Siemens business.
  
  
• Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training (Thursday Dec. 12, 2019)
  Designed to accelerate deep learning deployment, the accelerator’s core Deep Thinking Unit (DTU) is based on GF’s 12LP™ FinFET platform with 2.5D packaging to deliver fast, power-efficient data processing for cloud-based AI training platforms.
  
  
• UMC Announces 22nm Technology Readiness Following Silicon Validation on World's Smallest USB 2.0 Test Vehicle (Monday Dec. 02, 2019)
  United Microelectronics today announced the technology readiness of its 22nm process technology following first-pass silicon success using a USB 2.0 test vehicle.
  
  
• MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology (Friday Nov. 08, 2019)
  MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today announced that the industry’s first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC.
  
  
• USC ISI The MOSIS Service and Samsung Foundry collaborate to spur microelectronics innovation in the US (Tuesday Oct. 22, 2019)
  Partnership through USC Information Sciences Institute's MOSIS Service will offer multi-project-wafer runs for microelectronics by combining MOSIS Service integrated circuits manufacturing services with Samsung's foundry device fabrication technology
  
  
• X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform (Thursday Oct. 17, 2019)
  X-FAB Silicon Foundries SE today announced the availability of SONOS-based Flash and embedded EEPROM on its widely implemented XT018 BCD-on-SOI platform.
  
  
• Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich (Thursday Oct. 10, 2019)
  To address the growing demand in the autonomous and electric vehicle market, Samsung offers various foundry solutions based on 28nm FDS and 14nm process
  
  
• GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems (Thursday Oct. 10, 2019)
  GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today that it is working with Arm® to offer secure system-on-chip (SoC) solutions on GF’s 22FDX® platform, based on FD-SOI, for cellular IoT applications.