Foundries News

• TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume (Monday Oct. 07, 2019)
  TSMC (TWSE: 2330, NYSE: TSM) today announced that its seven-nanometer plus (N7+), the industry’s first commercially available Extreme Ultraviolet (EUV) lithography technology, is delivering customer products to market in high volume.
  
  
• GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications (Friday Sep. 27, 2019)
  GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, announced today at its annual Global Technology Conference (GTC) that since its launch in 2017, more than 20 clients representing more than $1 billion in design win revenue are now working with GF’s enhanced 45RFSOI solution for 5G/mmWave mobile and wireless infrastructure applications.
  
  
• Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing (Thursday Sep. 26, 2019)
  Arm and TSMC, the High-Performance Computing (HPC) industry leaders, today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm® cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging solution.
  
  
• UMC Receives Final Approval for 100% Acquisition of Mie Fujitsu Semiconductor (Wednesday Sep. 25, 2019)
  UMC today announced that the company has satisfied all closing conditions, including final approval from all relevant government agencies, for the full acquisition of Mie Fujitsu Semiconductor Limited
  
  
• GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications (Tuesday Sep. 24, 2019)
  Innovative solution based on GF’s most advanced FinFET platform offers best-in-class performance, key new features to address evolving AI requirements, compelling economics and industry-leading physical IP from Arm
  
  
• TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints (Tuesday Aug. 27, 2019)
  TSMC is in the process of reviewing the complaints filed by GlobalFoundries on August 26, but is confident that GlobalFoundries’ allegations are baseless.
  
  
• GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany (Monday Aug. 26, 2019)
  GLOBALFOUNDRIES (GF), the world’s leading specialty foundry based in the United States, today filed multiple lawsuits in the U.S. and Germany alleging that semiconductor manufacturing technologies used by Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) infringe 16 GF patents.
  
  
• Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement (Monday Aug. 19, 2019)
  Toppan Photomasks and GLOBALFOUNDRIES (GF) today announced that they have entered into a multi-year supply agreement in which Toppan will provide GF with photomasks and related services currently supported by GF’s Burlington, Vermont U.S. photomask manufacturing operation.
  
  
• GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications (Wednesday Aug. 07, 2019)
  GLOBALFOUNDRIES today announced that it has taped-out an Arm®-based 3D high-density test chip that will enable a new level of system performance and power efficiency for computing applications such as AI/ML and high-end consumer mobile and wireless solutions.
  
  
• Ambiq Micro Achieves World-Leading Power Consumption Performance with TSMC 40ULP Technology (Tuesday Jul. 02, 2019)
  Ambiq Micro and TSMC today announced that Ambiq’s Apollo3 Blue wireless SoC, built on TSMC’s 40 nanometer ultra-low power (40ULP) process, has achieved world-leading power consumption performance.
  
  
• GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements to Meet Accelerating Demand in 5G, IoT and Data Center (Friday Jun. 07, 2019)
  GLOBALFOUNDRIES (GF) and Soitec today announced that they have signed multiple long-term supply agreements for 300mm silicon-on-insulator (SOI) wafers to secure the high-volume supply to meet the growing demand from GF customers for its differentiated radio-frequency-silicon-on-insulator (RF-SOI), fully-depleted-silicon-on-insulator (FD-SOI) and silicon photonics technology platforms.
  
  
• Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform (Wednesday May. 15, 2019)
  
  
  
• TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement (Friday Apr. 26, 2019)
  TSMC today announced the expansion of the Open Innovation Platform ® (OIP) Cloud Alliance, with Mentor joining inaugural members Amazon Web Services, Cadence, Microsoft Azure, and Synopsys.
  
  
• ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility (Monday Apr. 22, 2019)
  ON Semiconductor Corporation (Nasdaq: ON) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York.
  
  
• TSMC Unveils 6-nanometer Process (Tuesday Apr. 16, 2019)
  TSMC (TWSE: 2330, NYSE: TSM) today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with direct migration from N7-based designs.
  
  
• Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits (Tuesday Apr. 16, 2019)
  Samsung Electronics today announced that its 5-nanometer (nm) FinFET process technology is complete in its development and now is ready for customers’ samples. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process offerings, Samsung is proving once again its leadership in the advanced foundry market.
  
  
• TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology (Wednesday Apr. 03, 2019)
  TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets.
  
  
• MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts (Wednesday Mar. 06, 2019)
  MACOM Technology Solutions Inc. (“MACOM”), and GLOBALFOUNDRIES (“GF”) today announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using GF’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands
  
  
• GLOBALFOUNDRIES Crosses Billion-Dollar Design Win Threshold with 8SW RF SOI Technology (Wednesday Feb. 20, 2019)
  GLOBALFOUNDRIES today announced that the company’s mobile-optimized 8SW RF SOI technology platform has delivered more than a billion dollars of client design win revenue since its launch in September 2017.
  
  
• VIS To Acquire GLOBALFOUNDRIES' Fab 3E In Singapore (Thursday Jan. 31, 2019)
  Vanguard International Semiconductor Corporation (VIS) and GLOBALFOUNDRIES (GF) today announced that VIS will acquire GF’s Fab 3E in Tampines, Singapore. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business.
  
  
• Soitec Expands Collaboration with Samsung Foundry on FD-SOI Wafer Supply (Tuesday Jan. 22, 2019)
  Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, announced today an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.
  
  
• SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum (Monday Jan. 07, 2019)
  SkyWater Technology Foundry, the industry’s most advanced U.S.-based and solely U.S.-owned Trusted Foundry, today announced its Multi Project Wafer (MPW) FastShuttle program offering customers quick and low-cost prototyping and design enablement with access to high performance processes and regularly scheduled launch dates.
  
  
• GLOBALFOUNDRIES Announces Industry's First 300mm SiGe Foundry Technology to Meet Growing Data Center and High-Speed Wireless Demands (Thursday Nov. 29, 2018)
  GLOBALFOUNDRIES today announced its advanced silicon germanium (SiGe) offering, 9HP, is now available for prototyping on the company’s 300mm wafer manufacturing platform.
  
  
• GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications (Thursday Nov. 15, 2018)
  GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF’s 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash®) technology.
  
  
• UMC Issues Follow-up Statement Regarding Recent Legal Developments (Friday Nov. 09, 2018)
  UMC Issues Follow-up Statement Regarding Recent Legal Developments
  
  
• Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions (Thursday Oct. 18, 2018)
  Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the launch of its new commercial 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology for wafer production.
  
  
• Samsung Electronics Starts Production of EUV-based 7nm LPP Process (Thursday Oct. 18, 2018)
  Samsung Electronics today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology.
  
  
• GLOBALFOUNDRIES Expands RFwave Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G (Thursday Oct. 11, 2018)
  GLOBALFOUNDRIES today announced the addition of nine new partners to its growing RFwave Partner Program, including AkronIC, Ask Radio, Catena, University of Waterloo Centre for Intelligent Antenna and Radio Systems (CIARS), Giga Solution, Helic, Incize, Mentor Graphics and Xpeedic Technology.
  
  
• TSMC Announces OIP Ecosystem Enabled in the Cloud (Wednesday Oct. 03, 2018)
  TSMC today announced the initial availability of its Open Innovation Platform® Virtual Design Environment (OIP VDE), which enables semiconductor customers to securely design in the cloud, leveraging TSMC OIP design infrastructures within the flexibility of cloud infrastructures.
  
  
• GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications (Thursday Sep. 27, 2018)
  GLOBALFOUNDRIES announced today at its annual Global Technology Conference (GTC), that the company’s mobile-optimized 8SW 300mm RF SOI technology platform has been qualified and is in production.