Foundries News

• GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow's Intelligent Systems (Wednesday Sep. 26, 2018)
  As part of the company's new focus on intensifying investment in differentiation, GLOBALFOUNDRIES announced today at its annual Global Technology Conference (GTC), plans to introduce a full set of new technology features to its 14/12nm FinFET offering.
  
  
• GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings (Tuesday Aug. 28, 2018)
  GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.
  
  
• TSMC Details Impact of Computer Virus Incident (Monday Aug. 06, 2018)
  TSMC today provided an update on the Company’s computer virus outbreak on the evening of August 3, which affected a number of computer systems and fab tools in Taiwan.
  
  
• GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology (Tuesday Jul. 10, 2018)
  GLOBALFOUNDRIES today announced that the company’s 22nm FD-SOI (22FDX®) technology has delivered more than two billion dollars of client design win revenue.
  
  
• GLOBALFOUNDRIES to Deliver Socionext's Next Generation Graphics Controller for Advanced In-Vehicle Display Applications (Monday Jul. 02, 2018)
  GLOBALFOUNDRIES today announced that Socionext Inc. will manufacture the third and latest generation of its graphics display controllers, the SC1701, on GF’s 55nm Low Power Extended (55LPx) process technology with embedded non-volatile memory (SuperFlash®).
  
  
• Shanghai Huali Microelectronics Corporation (HLMC) Announces Collaboration with Adesto and CNE around RRAM Technology for RFID, Stand Alone NVM and Microcontroller Applications (Wednesday Jun. 13, 2018)
  HLMC announces it is collaborating with Adesto Technologies and Crocus Nano Electronics to develop new RFID and microcontroller (MCU) products based on Adesto’s Resistive RAM (RRAM) memory technology trademarked as Conductive Bridging RAM (CBRAM®).
  
  
• GLOBALFOUNDRIES Enters Volume Production of Ultra High Voltage Process Technology for Industrial and Power Applications (Tuesday May. 29, 2018)
  GLOBALFOUNDRIES today announced that its 180nm Ultra High Voltage (180UHV) technology platform has entered volume production for a range of client applications, including AC-DC controllers for industrial power supplies, wireless charging, solid state and LED lighting, as well as AC adapters for consumer electronics and smartphones.
  
  
• Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation (Wednesday May. 23, 2018)
  Samsung Electronics, a world leader in advanced semiconductor technology solutions, today unveiled a series of new silicon innovations at the heart of future high-performance computing and connected devices.
  
  
• GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology (Wednesday May. 23, 2018)
  GLOBALFOUNDRIES today announced that its 22nm FD-SOI (22FDX®) technology platform has been certified to AEC-Q100 Grade 2 for production.
  
  
• Arbe Robotics Selects GLOBALFOUNDRIES for its High-Resolution Imaging Radar to Enable Safety for Autonomous Cars (Friday Apr. 27, 2018)
  GLOBALFOUNDRIES today announced that Arbe Robotics has selected GF’s 22FDX® process for its groundbreaking patented imaging radar that will achieve fully automated system capabilities and enable safer driving experiences for autonomous vehicles.
  
  
• GLOBALFOUNDRIES Launches RF Ecosystem Program to Accelerate Time-to-Market for Wireless Connectivity, Radar and 5G Applications (Wednesday Mar. 21, 2018)
  GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFwave™, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.
  
  
• GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity (Wednesday Mar. 14, 2018)
  GLOBALFOUNDRIES today revealed new details of its silicon photonics roadmap to enable the next generation of optical interconnects for datacenter and cloud applications. The company has now qualified the industry’s first 90nm manufacturing process using 300mm wafers, while also unveiling its upcoming 45nm technology to deliver even greater bandwidth and energy efficiency.
  
  
• Samsung Strengthens its Foundry Customer Support with New SAFE Foundry Ecosystem Program (Thursday Jan. 25, 2018)
  Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, has announced today its continued commitment to first-pass silicon success for its foundry customers’ chip designs by launching the Samsung Advanced Foundry Ecosystem (SAFETM) program.
  
  
• GLOBALFOUNDRIES Delivering 45nm RF SOI Customer Prototypes for 5G Applications (Wednesday Jan. 24, 2018)
  GLOBALFOUNDRIES today announced that its 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production.
  
  
• STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leadership (Tuesday Jan. 09, 2018)
  GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) today announced that ST has selected GF’s 22nm FD-SOI (22FDX®) technology platform to support its next-generation of processor solutions for industrial and consumer applications.
  
  
• UMC Announces Availability of 40nm SST Embedded Flash Process (Thursday Dec. 21, 2017)
  UMC today announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash® non-volatile memory. The newly available 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s mass production 55nm SST technology.
  
  
• X-FAB Introduces New Low-Power eFlash Block Optimized for Energy Harvesting & IoT Devices (Tuesday Dec. 19, 2017)
  X-FAB today announced the availability of two new Non-Volatile Memory (NVM) IP solutions - a low power embedded Flash (eFlash) IP block and a NVRAM compiler.
  
  
• SMIC and Efinix Quickly Deliver the First Quantum-Accelerated Silicon Product (Wednesday Dec. 13, 2017)
  SMIC and Efinix™ , an innovator in programmable products platforms and technologies, today jointly announced that Efinix has received silicon product samples for its first Quantum™ accelerated programmable product platform built on SMIC's 40nm process.
  
  
• GLOBALFOUNDRIES and Ayar Labs Establish Strategic Collaboration to Speed Up Data Center Applications (Monday Dec. 04, 2017)
  GLOBALFOUNDRIES and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, today announced a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.
  
  
• Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology (Wednesday Nov. 29, 2017)
  Samsung Electronics today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus).
  
  
• GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions (Wednesday Nov. 15, 2017)
  GLOBALFOUNDRIES today announced it has demonstrated the next generation of 112Gbps SerDes capability. GF’s High Speed SerDes (HSS) solutions include best-in-class architecture for 112G to 56G, 30G and 16G SerDes IPs to enable connectivity for cloud computing, hyperscale data center, and networking applications.
  
  
• Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC (Wednesday Nov. 15, 2017)
  Cypress and UMC today announced that Cypress' 65nm and 40nm technology platforms are the industry's first to achieve Qualified Manufacturers List (QML) certification for their advance product flows.
  
  
• GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card (Wednesday Nov. 15, 2017)
  GLOBALFOUNDRIES and Fudan Microelectronics Group today announced they have produced a next generation dual interface CPU card, using GF’s 55nm Low Power Extended (55LPx) technology platform.
  
  
• Samsung Completes Qualification of 8nm LPP Process (Thursday Oct. 19, 2017)
  Samsung Electronics, a world leader in advanced semiconductor technology, announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.
  
  
• GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow's Connected Car (Thursday Oct. 12, 2017)
  GLOBALFOUNDRIES today unveiled AutoPro™, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.
  
  
• TSMC to Build 3nm Fab in Tainan Science Park (Friday Sep. 29, 2017)
  TSMC today announced that, following careful evaluation, the Company’s planned advanced 3nm fab will be located in the Tainan Science Park to fully leverage the company’s existing cluster advantage and the benefit of a comprehensive supply chain.
  
  
• SMIC and Sanechips (ZTE Microelectronics) Announce the First Commercial NB-IoT Chip Designed and Manufactured in Mainland China (Thursday Sep. 28, 2017)
  SMIC and Sanechips Technology Co., Ltd. (previously named ZTE Microelectronics Technology Co., Ltd.), a global leader in telecommunications and information technology, jointly announced the launch of RoseFinch7100 which is the first commercial NB-IoT (Narrow Band Internet of Things) chip designed and manufactured by Mainland Chinese firms independently.
  
  
• TowerJazz and Crocus Expand Presence in Magnetic Sensors Market through Successful Licensing of Crocus' IP and Volume Manufacturing by TowerJazz (Wednesday Sep. 27, 2017)
  TowerJazz today announce volume manufacturing of Crocus TMR (Tunnel MagnetoResistance) sensors, using TowerJazz’s 0.13um CMOS process with a dedicated magnetic module in the Cu BEOL.
  
  
• GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications (Thursday Sep. 21, 2017)
  GLOBALFOUNDRIES today announced its vision and roadmap for a sweeping range of technology platforms designed to help customers transition to next-generation 5G wireless networks.
  
  
• GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems (Thursday Sep. 21, 2017)
  GLOBALFOUNDRIES is now delivering in volume its 14nm High Performance (HP) technology that will enable IBM’s next-generation of processors for server systems. The jointly developed 14HP process is specifically designed to deliver the ultra-high performance and data-processing capacity IBM needs to support its cloud, commerce, and enterprise solutions in the era of big data and cognitive computing.