Foundries News

• SMIC Shenzhen Launches Construction of the First 12-Inch IC Production Line in South China (Thursday Nov. 03, 2016)
  SMIC announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC's Shenzhen facility. It will be the very first 12-inch fab in South China.
  
  
• SMIC TianJin Launches Capacity Expansion Project; Expected to Become the World's Largest Integrated 8-Inch IC Production Line (Tuesday Oct. 18, 2016)
  
  
  
• SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab (Thursday Oct. 13, 2016)
  SMIC today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.
  
  
• X-FAB to Acquire Assets of Altis Semiconductor (Monday Oct. 03, 2016)
  X-FAB Silicon Foundries has today announced that it will acquire the assets of Altis Semiconductor, a specialty stand-alone foundry located in the Greater Paris area, out of insolvency proceedings.
  
  
• MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology (Monday Oct. 03, 2016)
  MagnaChip, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today the availability of a new 0.13 micron Slim Flash process technology, based on 0.13 micron EEPROM.
  
  
• GLOBALFOUNDRIES to Deliver Industry's Leading-Performance Offering of 7nm FinFET Technology (Friday Sep. 16, 2016)
  GLOBALFOUNDRIES today announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology that will offer the ultimate in performance for the next era of computing applications. This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.
  
  
• GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX Platform (Friday Sep. 16, 2016)
  GLOBALFOUNDRIES today introduced a scalable, embedded magnetoresistive non-volatile memory technology (eMRAM) on its 22FDX platform, providing system designers with access to 1,000x faster write speeds and 1,000x more endurance than today’s non-volatile memory (NVM) offerings.
  
  
• UMC Reports Sales for August 2016 (Friday Sep. 09, 2016)
  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), today reported unaudited net sales for the month of August 2016.
  
  
• GLOBALFOUNDRIES Unveils Ecosystem Partner Program to Accelerate Innovation for Tomorrow's Connected Systems (Thursday Sep. 08, 2016)
  GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator™, an ecosystem designed to facilitate 22FDX™ system-on-chip (SoC) design and reduce time-to-market for its customers.
  
  
• GLOBALFOUNDRIES Extends FDX Roadmap with 12nm FD-SOI Technology (Thursday Sep. 08, 2016)
  GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry’s first multi-node FD-SOI roadmap. Building on the success of its 22FDXTM offering, the company’s next-generation 12FDXTM platform is designed to enable the intelligent systems of tomorrow across a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles.
  
  
• UMC Forges Strategic Partnership with APM to Enhance MEMS Service Capabilities (Monday Sep. 05, 2016)
  UMC will leverage its 8” and 12” production capabilities with APM’s 6” fab and extensive MEMS know-how and prototyping experience to provide chip designers with a flexible and scalable end-to-end MEMS manufacturing solution.
  
  
• Renesas Electronics and TSMC Announce 28nm MCU Collaboration for Next-Generation Green and Autonomous Vehicles (Thursday Sep. 01, 2016)
  Renesas Electronics and TSMC today announced that they are collaborating on 28nm (nanometer) embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) targeted at next-generation green and autonomous vehicles
  
  
• UMC Qualifies 0.18um BCD Process for Most Stringent AEC-Q100 Grade-0 Automotive ICs (Monday Aug. 01, 2016)
  United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has verified on silicon its 0.18um Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive ICs.
  
  
• SJSemi and Qualcomm Jointly Announce Mass Production of 14nm Wafer Bumping Technology (Friday Jul. 29, 2016)
  SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.
  
  
• AppliedMicro Adopting TSMC 7nm FinFET Process Technology (Monday Jul. 11, 2016)
  Applied Micro Circuits today announced that it has adopted 7nm process technology from TSMC, the world’s leading foundry, to enable AppliedMicro’s innovative silicon products for cloud computing and networking applications.
  
  
• SMIC Commences Successful Mass Production of Qualcomm Snapdragon 425 Processor in Beijing (Wednesday Jun. 22, 2016)
  SMIC announces that the Snapdragon™ 425 processor and MDM9x07 has passed customer qualification and begun mass production in Beijing, after the successful technology transfer from SMIC's Shanghai 12-inch fab to SMIC's majority owned joint venture fab in Beijing.
  
  
• Marvell Releases New ARMADA Hyperscale Virtual SoC Families Featuring the ARM Cortex-A72 CPU with Advanced Networking and I/O Support (Tuesday May. 31, 2016)
  Marvell today announced the availability of production samples of the industry's first ARM® Cortex®-A72 based system-on-chip (SoC) families built on Marvell's ground-breaking MoChi™ architecture, the Marvell® ARMADA® 7000 and 8000.
  
  
• GLOBALFOUNDRIES to Expand Presence in China with 300mm Fab in Chongqing (Tuesday May. 31, 2016)
  GLOBALFOUNDRIES today announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the company plans to expand its global manufacturing footprint by establishing a 300mm fab in China.
  
  
• GLOBALFOUNDRIES Releases Performance-Enhanced 130nm SiGe RF Technology to Advance Next Generation Wireless Network Communications (Monday May. 23, 2016)
  GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio. The technology is optimized for customers who need improved performance solutions for automotive radar, satellite communications, 5G millimeter-wave base stations and other wireless and wireline communication network applications.
  
  
• MagnaChip and YMC Expand Cost-Effective 0.18um Multiple-Time Programmable (MTP) Manufacturing Processes (Tuesday May. 10, 2016)
  MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it has expanded its line of cost effective 0.18 micron multiple-time programmable intellectual property (MTP-IP) devices.
  
  
• Hua Hong Semiconductor's 90nm eFlash Process Platform Successfully Achieved Mass Production (Wednesday Apr. 06, 2016)
  Hua Hong Semiconductor, a global leading pure-play 200mm foundry, today announced the successful mass production of its 90nm embedded Flash (eFlash) process platform for fabrication of highly competitive chips featuring small die size, low power and high performance
  
  
• TSMC and Nanjing Sign 12-inch Fab Investment Agreement (Monday Mar. 28, 2016)
  TSMC today announced that the Company and the municipal government of Nanjing, China have signed an investment agreement. This agreement affirms that TSMC will make an investment in Nanjing valued at US$3 billion to establish TSMC (Nanjing) Co. Ltd., a wholly-owned subsidiary managing a 12-inch wafer fab and a design service center.
  
  
• ARM and TSMC Announce Multi-Year Agreement to Collaborate on 7nm FinFET Process Technology for High-Performance Compute (Tuesday Mar. 15, 2016)
  ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs. The new agreement expands the companies’ long-standing partnership and advances leading-edge process technologies beyond mobile and into next-generation networks and data centers.
  
  
• GLOBALFOUNDRIES Releases New 7SW SOI RF PDK Featuring Latest Keysight Technologies Advanced Design System Software (Tuesday Mar. 15, 2016)
  GLOBALFOUNDRIES today announced the availability of a new set of process design kits (PDKs) with an interoperable co-design flow to help chip designers improve design efficiency and deliver differentiated RF front-end solutions in increasingly sophisticated mobile devices.
  
  
• GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices (Tuesday Mar. 15, 2016)
  GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.
  
  
• SMIC 28nm HKMG Process Ready to Launch Smartphone SoC with Leadcore (Tuesday Feb. 16, 2016)
  SMIC and Leadcore, one of the core members of Datang Telecom Technology and Industry Group, jointly announce that SMIC's 28nm HKMG (High-K Metal Gate) process is ready with customer's NTO (New Tape Out) success
  
  
• Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology (Thursday Jan. 14, 2016)
  Samsung Electronics Co., Ltd. today announced that it has begun mass production of advanced logic chips utilizing its 14nm LPP (Low-Power Plus) process, the 2nd generation of the company’s 14nm FinFET process technology.
  
  
• TowerJazz Announces Availability of its Next-Generation Power Management Platform Enabling up to 30% Efficiency Boost and Form Factor Reduction (Wednesday Nov. 18, 2015)
  TowerJazz today announced a new 0.18um power management process with an industry best-in-class on-resistance (Rdson) of 9 mohm-mm2 for a 30V device. Low on-resistance helps power ICs achieve higher efficiency, lower power consumption, lower temperature rise and smaller form factor.
  
  
• UMC's Automotive Semiconductor Revenue Doubles YoY on Strong Customer Adoption (Tuesday Nov. 17, 2015)
  UMC today announced that revenue from its manufacture of semiconductors used in automotive applications has doubled (YoY) from 2014 to 2015. Full-year 2015 revenue for automotive ICs at UMC is expected to be hundreds of millions of US dollars.
  
  
• GLOBALFOUNDRIES Launches High-Performance ASIC Offering on 14nm FinFET Process Technology (Wednesday Nov. 11, 2015)
  GLOBALFOUNDRIES today announced the availability of FX-14, an application-specific integrated circuit (ASIC) offering built on the company’s next-generation 14nm FinFET process technology.