Foundries News

• GLOBALFOUNDRIES Achieves 14nm FinFET Technology Success for Next-Generation AMD Products (Monday Nov. 09, 2015)
  GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD (NASDAQ: AMD) products using GLOBALFOUNDRIES’ most advanced 14nm FinFET process technology.
  
  
• Leti Joins GLOBALFOUNDRIES' Eco-System Partners With Focus on Supporting 22FDX Platform (Wednesday Oct. 07, 2015)
  CEA-Leti today announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX™ technology platform.
  
  
• SMIC Receives 'Hi-Tech Enterprise Achievement Award' for the Second Time (Thursday Sep. 24, 2015)
  SMIC has been selected again by Hong Kong Yazhou Zhoukan Limited in the fifth Mainland Enterprises Listed in Hong Kong Ranking Award and awarded the Hi-Tech Enterprise Achievement Award for its outstanding business operations and overall performance.
  
  
• UMC Enters High Volume Touch IC Production using Foundry Industry's First 0.11um eFlash Process (Tuesday Sep. 22, 2015)
  United Microelectronics Corporation today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.
  
  
• GLOBALFOUNDRIES and Catena Partner to Provide Next-Generation RF Connectivity Solutions for Growing Wireless Markets (Friday Sep. 04, 2015)
  
  
  
• QEOS and GLOBALFOUNDRIES to Offer Industry's First CMOS Platform for MillimeterWave Markets (Friday Sep. 04, 2015)
  QEOS, Inc., a world leading designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.
  
  
• TowerJazz and TPSCo Announce Breakthrough RF Technology for Next-Generation 4G LTE Enabled Smartphones and IoT Applications (Thursday Sep. 03, 2015)
  TowerJazz, the global specialty foundry leader and TowerJazz Panasonic Semiconductor Co. (TPSCo), the leading analog foundry in Japan, today announced breakthrough RF technology for next-generation 4G LTE smartphones and IoT devices.
  
  
• SMIC's 28nm Chips Power Mainstream Smartphones Marking a New Era for Advanced Chip Manufacturing in China (Monday Aug. 10, 2015)
  SMIC today announced its 28nm process technology that is used for manufacturing Qualcomm® Snapdragon™ 410 processors, has been successfully adopted into mainstream smartphones.
  
  
• UMC Enters Volume Production for TSV Process Used to Enable AMD's High-Performance Radeon R9 Fury X GPU (Monday Jul. 20, 2015)
  UMC today announced that it has entered volume production for the Through-Silicon-Via (TSV) technology used on the AMD Radeon™ R9 Fury X, the flagship GPU in the recently announced Radeon™ R 300 Series of graphics cards.
  
  
• GLOBALFOUNDRIES Launches Industry's First 22nm FD-SOI Technology Platform (Monday Jul. 13, 2015)
  The “22FDX™” platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar technologies, providing an optimal solution for the rapidly evolving mainstream mobile, Internet-of-Things (IoT), RF connectivity and networking markets.
  
  
• IBM Research Alliance Produces Industr's First 7nm Node Test Chips (Thursday Jul. 09, 2015)
  An alliance led by IBM Research today announced that it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functioning transistors. The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything from smartphones to spacecraft.
  
  
• SMIC Receives "2014 Foundry Supplier of the Year" Award from Qualcomm (Thursday Jun. 25, 2015)
  SMIC today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.
  
  
• SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company (Tuesday Jun. 23, 2015)
  SMIC, Huawei; imec, and Qualcomm held a signing ceremony at the Great Hall of the People, to announce the formation of SMIC Advanced Technology Research & Development (Shanghai) Corporation, an equity joint venture company.
  
  
• UMC Collaborates with ARM to Validate UMC 14nm FinFET Process (Monday Jun. 22, 2015)
  UMC today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC’s 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node.
  
  
• Hua Hong Semiconductor Launches 0.11um Ultra-Low-Leakage Embedded Flash Process Platform That Delivers Powerful MCU Solutions for IoT (Friday Jun. 12, 2015)
  Hua Hong Semiconductor announced today to launch its latest process platform for 0.11μm Ultra-Low-Leakage (ULL) eFlash and EEPROM.
  
  
• Leti launches new Silicon Impulse FD-SOI Development Program, to Help Designers Broaden the Use of FD-SOI for Low-power Applications (Tuesday Jun. 09, 2015)
  CEA-Leti announced today that seven partners have joined its new FD-SOI IC development program, Silicon Impulse, launched to provide a comprehensive IC technology platform that offers IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.
  
  
• GLOBALFOUNDRIES Solidifies 14nm FinFET Design Infrastructure for Next-Generation Chip Designs (Tuesday Jun. 02, 2015)
  GLOBALFOUNDRIES today announced it has reached a critical milestone in providing a robust design infrastructure for its 14-nanometer (nm) FinFET process technology, supporting customer’s design starts on the foundry's latest manufacturing technology node.
  
  
• UMC Unveils UMC Auto Platform to Enable Automotive IC Designs (Tuesday May. 26, 2015)
  UMC Auto is a comprehensive platform that consists of a broad portfolio of automotive AEC-Q100 qualified technology solutions ranging from 0.5um to 28nm nodes, backed by robust manufacturing processes that comply with rigorous ISO TS-16949 automotive quality standards for all UMC fabs.
  
  
• GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications (Wednesday May. 20, 2015)
  GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices.
  
  
• TowerJazz and UCSD Demonstrate First 5G 256-Element 60 GHz Silicon Wafer-Scale Phased Array Transmitter (Friday May. 15, 2015)
  TowerJazz and The University of California, San Diego (UCSD) today announced they have collaborated to demonstrate the first 256-element (16 x 16) wafer-scale phased array transmitter with integrated high-efficiency antennas operating at 56-65 GHz frequency range.
  
  
• Samsung Breaks Ground on $14 Billion Fab (Monday May. 11, 2015)
  The world's most expensive semiconductor fabrication plant--at over $14 billion--was announced at the ground breaking ceremony Thursday (May 7) by Samsung.
  
  
• Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology (Tuesday May. 05, 2015)
  Microchip and GLOBALFOUNDRIES today announced the full qualification and availability of SST’s 55nm embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform.
  
  
• NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology (Tuesday Mar. 24, 2015)
  GLOBALFOUNDRIES and NXP Semiconductor today announced that they have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GLOBALFOUNDRIES’ 40-nanometer (nm) process technology platform.
  
  
• SMIC Achieves 8M Pixel CIS Production on 0.13-Micron BSI with Cista (Friday Feb. 27, 2015)
  SMIC and Cista have jointly announced the achievement of mass production for two CIS-BSI products, of 1.3MP resolution with 1.75-micron pixel and 8MP resolution with 1.4-micron pixel, respectively.
  
  
• GLOBALFOUNDRIES Joins imec to Develop Innovative RF Solutions for Internet of Things Applications (Tuesday Feb. 17, 2015)
  
  
  
• Samsung Announces Mass Production of Industry's First 14nm FinFET Mobile Application Processor (Monday Feb. 16, 2015)
  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.
  
  
• MagnaChip to Offer Enhanced 0.13 Micron Embedded EEPROM Process Technology (Monday Feb. 02, 2015)
  MagnaChip announced today that it now offers a high voltage option for its 0.13 micron embedded EEPROM technology. This enhanced process increases noise immunity by improving the signal-to-noise ratio (SNR), a critical factor in touch sensing IC performance.
  
  
• Sony Joins FDSOI Club (Monday Feb. 02, 2015)
  Sony Corp. revealed that the company’s next-generation Global Navigation Satellite System (GNSS) chip will use 28-nm Fully Depleted Silicon On Insulator (FDSOI) process.
  
  
• UMC First Foundry in Taiwan to Receive ISO 15408-EAL6 Certification (Monday Jan. 12, 2015)
  UMC today announced that its Fab 12A has obtained ISO 15408-EAL6 certification issued by the German Government’s Federal Office for IT Security (BSI), making UMC the first foundry in Taiwan to provide IC manufacturing services that comply with the ISO 15408 Common Criteria.
  
  
• MagnaChip Offers Automotive Qualified 0.18um Semiconductor Manufacturing Process Technology (Monday Jan. 12, 2015)
  MagnaChip announced today that it has started to offer 0.18um automotive qualified process technology to foundry customers focused on high reliability automotive semiconductor applications.