Multi Protocol Endpoint IP Core for Safe and Secure Ethernet Network
Rambus Appoints First Fellow
LOS ALTOS, California, United States - May 2, 2006 -- Rambus (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today announced it has appointed Craig Hampel to the company’s highest technical position, Rambus Fellow. Hampel is the company’s first technologist to be appointed to Fellow.
As a technical director at Rambus, Hampel, 42, has been extensively involved in the development and deployment of the company’s leading-edge technology. He has led engineering efforts for Rambus’ patented interface designs that have enabled highly successful products across computing, communications and consumer electronics. Hampel’s development of memory solutions at Rambus spans more than 13 years and he is an inventor on 192 issued or pending patents in the area of high-speed memory and interface technology.
“Craig has been instrumental on the design and definition of both our RDRAM® memory interface and XDR™ memory interface solutions. He has shown tremendous ability to solve customers’ most daunting interface challenges enabling many break-through products,” said Mark Horowitz, founder and chief scientist at Rambus. “The Rambus Fellow program recognizes exemplary technical leadership and contribution which Craig’s work amply demonstrates. We congratulate Craig on this appointment and look forward to his continued leadership in advancing our state-of-the-art technology.”
The Rambus Fellow program was recently developed by the company to recognize those individuals that provide the highest levels of technical leadership and strategic guidance for the company. Hampel holds a B.S. degree in electrical engineering from the University of Illinois.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.
|
Related News
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |