Automotive FPGAs make grade
(06/13/2008 12:00 AM EDT)
With the entire semiconductor industry in a state of flux and established markets offering little growth, programmable logic suppliers are exploring new opportunities. One of the more promising markets that vendors of FPGAs and complex programmable logic devices (CPLDs) have been eyeing is the automotive sector.
It's hardly a secret that the electronics content in automobiles has skyrocketed over the past few years. A glance at the dashboard of any new vehicle tells you all you need to know. Yesterday's AM/FM radio and CD player has morphed into an infotainment center that now adds MP3 audio, DVD playback, GPS navigation, hands-free cell phone access and even wireless Internet browsing.
Many of these new functions place a premium on fast IC reprogrammability, not only for entertainment, but for engine control, driver assistance and other tasks. With feature sets and functions changing more rapidly than typical drawn-out automotive design cycles, designers are now looking to replace ASICs and ASSPs with easily reconfigured FPGAs or CPLDs.
E-mail This Article | Printer-Friendly Page |
Related News
- Lattice Introduces New Automotive Grade FPGAs to Accelerate Affordable Innovation
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- Weebit Nano qualifies its ReRAM module for automotive grade temperature
- Introducing T2M's impressive collection of Silicon Proven, Automotive Grade Interface IP Cores
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing