Updated: Sequans' WiMax chip drives Sprint Nextel's first 4G phone
Junko Yoshida, EETimes
(03/18/2010 10:55 AM EDT)
NEW YORK — It turns out that it's Sequans Communications, not Beceem, whose WiMax chip was designed into Sprint Nextel's first WiMax (4G) phone, scheduled to be unveiled next week during the CTIA wireless show.
By extension, it isn't MIPS Technologies, but CEVA, that received a big boost, since Sequans is using CEVA's DSP core in its WiMax/LTE baseband silicon.
Sequans' communication director Kimberly Tassin contacted EE Times to reveal that her company's baseband silicon is driving Sprint Nextel's first 4G phone.
E-mail This Article | Printer-Friendly Page |
Related News
- Sequans Selects CEVA DSP Core for LTE / WiMAX Chipsets
- CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity
- Sequans Communications Selects S3 Group's Power Management Solution for WiMAX / LTE System on Chip
- Sequans Communications Uses VeriSilicon's ZSP Core for WiMAX/LTE Products
- CEVA DSP Powers Samsung's First Generation LTE Modem
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing