Multi Protocol Endpoint IP Core for Safe and Secure Ethernet Network
Malaysia's 1st Silicon works with Singapore's FTD on IP core verification
Malaysia's 1st Silicon works with Singapore's FTD on IP core verification
By Semiconductor Business News
February 26, 2002 (6:37 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020226S0044
KUCHING, Malaysia -- Semiconductor foundry supplier 1st Silicon (Malaysia) Sdn. Bhd. here today announced a marketing and technical support agreement with Singapore-based FTD Technology Pte. Ltd., a provider of analog and mixed-signal intellectual property (IP) for chip designs. "Both companies will select the IP cores to be designed onto a 1st Silicon testchip," said P. Bala, chief executive officer of FTD Technology. "We will coordinate the development, performance characterization, design flow verifications and functional verifications of FTD's cores based on 1st Silicon's testchip layout and test plans, their Spice models, library, and 1st Silicon's design rules." He said the collaboration will enable both companies to increase offerings for mutual customers. Four-year-old 1st Silicon's 200-mm wafer fab will have a capacity in excess of 30,000 eight-inch wafers per month when fully ramped. The company started volume production with 0.25 -micron digital and mixed-signal CMOS technology one year ago, and it has introduced 0.18-micron processes.
Related News
- Silicon Storage Technology (SST) announces embedded flash technology licensing agreement with Malaysia's 1st Silicon
- Truechip Partners with Advinno to Market Verification IP Products in Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia, Brunei & Cambodia
- Silicon Works Adopts Hardent's VESA DSC Decoder IP
- Silicon Image Selects Denali's Verification IP Products for Development Efforts
- MoSys Ports 1T-SRAM-Q Technology to NEC Electronics' 90-Nanometer Logic Process; Initial Silicon Verification Achieved for 1T-SRAM-R, in Fabrication for 1T-SRAM-Q
Breaking News
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |