DMP 3D Graphics IP Core "SMAPH-S" is selected by Renesas Electronics
Tokyo, Japan, April 23 2013 – Digital Media Professionals Inc. (DMP), a leading provider of 2D/3D graphics IP (Intellectual Property) cores, announced today that Renesas Electronics, a premier supplier of advanced semiconductor solutions, has selected DMP 3D graphics IP core “SMAPH-S”.
SMAPH-S, which supports OpenGL ES® 3.0/2.0, is designed to deliver the best performance at the smallest area while minimizing power consumption. SMAPH-S supports a wide range of product applications from mobile devices such as smartphone and tablet, to multi-function printers, smart TV etc, using a variety of operating systems including Android, Linux, Windows, VxWorks and micro-ITRON. Its small area and low power consumption help to enhance product competitiveness of its adopters.
Related |
Scalable 3D Graphics Accelerator |
“We are honored to license SMAPH-S to Renesas Electronics. The requirement for rich graphics expression is growing rapidly, and graphics IP core performance is one of the key factors for recent devices. It is very satisfying for us to have our high performance, small area size and low power consumption recognized by a leading provider like Renesas Electronics.” – Tatsuo Yamamoto, CEO, DMP.
About DMP
Digital Media Professionals Inc. (TOKYO: 3652) develops industry leading 2D and 3D graphics solutions for global consumer electronics, mobile, embedded and automotive markets. The company was founded in Tokyo, Japan in 2002 and is currently developing several graphics IP cores based on the Khronos™ Group open standards and DMP’s cutting edge 3D graphics IP “Maestro Technology”
|
DMP Inc. Hot IP
Related News
- DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances
- DMP 3D Graphics IP Core "PICA200 Lite" is adopted for OLYMPUS PEN Lite E-PL5.OLYMPUS PEN mini E-PM2
- DMP SMAPH-S Products to Support OpenGL ES 3.0 API Standard
- DMP 3D Graphics IP Core "PICA200 Lite" is adopted for OLYMPUS Tough TG-1
- TES Electronic Solutions Selected By NEC Electronics for 3D Embedded Graphics Technology
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |