Four Channel LVDS Serializer
USB-C 3.1 DisplayPort 1.3 TX in TSMC 16FFC
14-bit 1.2MS/s SAR ADC in TSMC 40nm
AXI QSPI with Execute in Place (XIP)
High Performance HEVC decoder IP release by Chips&Media
Sonics Develops Industry's First Energy Processing Unit Based on the ICE-Grain Power Architecture
Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
Careful IP Integration Key to First-Pass Silicon
An Efficient Device for Forward Collision Warning Using Low Cost Stereo Camera & Embedded SoC
Corner Case Scenario Generation (CCSG) Tool: A Novel Approach to find corner case bugs in next generation SoCs
New Algorithms for Vision Require a New Processor
The Road Ahead for Neural Networks in Embedded Systems
USB in Automotive Applications
Ed Sperling, Semiconductor Engineering May 30th, 2014
Arteris’ CEO digs into connected cars, smarter interconnects, platform strategies, and why it’s so hard to be a CEO in the semiconductor market these days.
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