IBM, GF Explore New Partners
Rick Merritt, EEtimes
8/4/2014 02:05 PM EDT
SAN JOSE, Calif. — Like an old married couple, IBM and Globalfoundries are still great partners, but at this stage, they just have different needs. At least, that's the theory I am brewing after a long discussion with Semiconductor Advisors market watcher Robert Maire late Friday afternoon.
Globalfoundries needs to grab the brass ring to cement its position as a top foundry player. That means big deals for high-margin, bleeding-edge fab business. TSMC is all over the 28nm node, so GF is trying to get out ahead of the 14nm node with its deal with Common Platform partner Samsung that apparently has an edge with the process.
With the technology in place, GF's next step was to put in the right team to drive to 14nm production. Enter Tom Caufield, the guy who led IBM's leading-edge East Fishkill, N.Y., plant for many years. "If anyone can do it, he can," Maire said.
E-mail This Article | Printer-Friendly Page |
Related News
- U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
- Tiempo Secure's TESIC RISC-V IP Secure Element successfully characterized on GlobalFoundries' 22FDX technology node
- Agile Analog partners with sureCore on CryoCMOS Innovate UK project
- GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets
- GlobalFoundries Advances RF Leadership with GF Connex™ Portfolio and Customer Collaborations
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process