Faraday Presents High-Performance IP and Ultra-Low-Power SoC Solutions at SEDEX 2016
HSINCHU, Taiwan -- October 25, 2016 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it will present its 28HPCU high-performance and 55ULP IoT solutions, including the newly-unveiled Uranus™ IoT SoC development platform, at the 18th Semiconductor Exhibition (SEDEX), October 26-28, 2016 in Seoul, Korea.
Driven by the market demand, Faraday offers a series of 28HPCU high-speed I/O IPs such as DDR4, V-by-One, and 12.5Gbps programmable SerDes, that can be applied to network communications, solid state drives (SSDs), multifunction printers (MFPs), and multimedia applications. Another spotlight during the show will be Faraday’s Uranus™ 55ULP SoC development platform, which is 32-bit MCU-based ultra-low power SoC with embedded flash memory, targeting to accelerate the development of wireless IoT applications. With the unique Turbo Mode design, the Uranus™ IoT development platform enables higher SoC performance advantage even though under button cell battery scenarios.
"For our first attendance in SEDEX, we are very excited to present our 28HPCU and 55ULP solutions," said Steve Wang, President of Faraday. "Since our establishment in 1993, Faraday has delivered more than 2,200 ASIC mass production projects, thus we are confident to help customers to develop successful SoC with more innovative features for IoT and other energy-efficient applications now and beyond. We look forward to exploring more opportunities at the show and building strong business relationships in Korea."
Conference:
October 26 (Wed), 4:20pm – 4:50pm, Room 203B, COEX Conference Room (North)
- Topic: Ultra-Low-Power ASIC Solution and Uranus™ SoC Platform for IoT
- Speaker: Raymond Lai, AVP of Marketing at Faraday Technology
Booth Demonstrations:
October 26 – 28 (Wed – Fri), Booth C134, COEX Hall C
- Faraday Uranus™ Ultra-Low-Power IoT SoC Development Platform (FIE3255)
- Faraday V-by-One Evaluation Board
About Faraday Technology Corporation
Faraday Technology Corporation is a leading fabless ASIC and silicon IP provider. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, MPEG4, H.264, USB 2.0/3.1 Gen 1, 10/100/1000 Ethernet, Serial ATA, PCI Express, and programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China. Faraday is listed on the Taiwan Stock Exchange, ticker 3035. For more information, please visit www.faraday-tech.com
|
Faraday Technology Corp. Hot IP
Related News
- Faraday Unveils Uranus SoC Development Platform for Ultra-Low-Power IoT
- 12bit 640Msps Dual-Channel IQ ADC High-Speed/High-Performance IP Cores for WiFi 6 RF SoC is available for immediate licensing
- Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
- SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production
- Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |