iPhone X's TrueDepth Module Dissected
Why Apple wanted ST's NIR sensors to use SOI
Junko Yoshida, EETimes
11/17/2017 00:01 AM EST
PARIS — Although experts in the imaging industry are aware of a complex “TrueDepth” module that Apple has devised for its iPhone X, most other details inside the device’s 3D system — chips, components, and all the way down to substrates — remain a deep, dark secret.
EE Times talked to Yole Développement, which completed this week a teardown of Apple iPhone X TrueDepth module in collaboration with its partner, System Plus Consulting. They deduced that silicon-on-insulator (SOI) wafers are being used in near-infrared (NIR) imaging sensors. They noted that SOI has played a key role in improving the sensitivity of NIR sensors — developed by STMicroelectronics — to meet Apple’s stringent demands.
Pierre Cambou, activity leader for imaging and sensors at Yole Développement, called the SOI-based NIR image sensors “a very interesting milestone for SOI.”
E-mail This Article | Printer-Friendly Page |
Related News
- ST's SPAD Imager Likely Linked to iPhone 8
- X-FAB Extends MEMS Platform - Pressure Sensor IP Cores and SOI-MEMS Now Available
- Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC
- Xiphera's Crypto Module Offers Customisable Offload and Acceleration Solutions
- Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices
Breaking News
- Packetcraft Delivers Bluetooth Software Enabling Channel Sounding to Early Access Licensees
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
- Rapid Silicon Introduces Revolutionary Rapid eFPGA Configurator for Hassle Free Embedded FPGA Evaluation
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game