NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Intel Reports Tepid Progress on 10 nm
By Dylan McGrath, EETimes
October 26, 2018
SAN FRANCISCO — Intel said that it’s making progress on improving 10-nm yields and reiterated its pledge to have 10-nm chips shipping by the 2019 holiday season.
In a conference call with analysts following a financial report that beat analysts’ expectations for the 12th straight quarter, Venkata (Murthy) Renduchintala, president of Intel’s Technology, Systems Architecture and Client Group, said that 10-nm yields are now tracking roughly in line with what the company experienced at the 14-nm node when it prepared to make that transition.
“We’re still very much reinforcing and reaffirming our previous guidance that we believe that we’ll have 10 nm shipping by holiday of 2019,” said Renduchintala. “And if anything, I feel more confident about that at this call than I did on the call a quarter ago. So we’re making good progress, and I think we’re making the quarter-on-quarter progress that’s consistent with prior generations having reset the progress curve.”
E-mail This Article | Printer-Friendly Page |
|
Related News
- Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry's First 64-Layer 3D NAND for Data Center
- Intel Claims Progress on 10nm Yields
- Samsung Edges TSMC in 10 nm
- Intel sees quad-patterned path to 10 nm chips
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
Breaking News
- CAN FD Controller & LIN 2.1 Controller IP Cores, Available for Immediate Licensing with Proven Automotive Compatibility
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
- TSMC plans 1.6nm process for 2026
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process