55nmHV MTP Non Volatile Memory for Standard CMOS Logic Process
Samsung Edges TSMC in 10 nm
Alan Patterson, EETimes
3/22/2017 00:01 AM EDT
INDIANAPOLIS — Samsung appears to be about a quarter ahead of Taiwan Semiconductor Manufacturing Co. (TSMC) with the ramp of 10-nm process technology, according to a veteran chip analyst.
Earlier this year, Samsung and TSMC said that they would launch 10-nm foundry services during the second quarter this year for customers such as Qualcomm, Mediatek, and Huawei’s semiconductor subsidiary, HiSilicon.
Somewhat ahead of schedule, Samsung last week announced that it has shipped 70,000 wafers of 10-nm LPE (low-power early) chips, independent analyst Andrew Lu noted in a report for intelligence provider Smartkarma.
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing