Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
By Alan Patterson, EETimes (September 29, 2022)
The U.S. Department of Defense (DoD) is Intel Foundry Services’ (IFS’s) “No. 1” customer, IFS president Randhir Thakur told EE Times, noting that IFS plans to be part of the DoD state-of-the-art heterogeneous integrated packaging (SHIP) program. That program will necessitate deep knowledge of gate-all-around (GAA) technology facilitating high-transistor–density 3D chips.
Intel’s new foundry unit has an initial $250 million contract with the DoD to provide chip design and development. The next step, for a much larger and unnamed dollar figure, will include manufacturing if IFS can meet certain national security criteria, Thakur said in an interview on the sidelines of Intel’s latest fab project in Columbus, Ohio
E-mail This Article | Printer-Friendly Page |
Related News
- U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification
- New U.S. Rule Could "Impair" China's AI Progress
- Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry
- Intel does ARM: Citi 'identifies' another possible customer
- Is Cisco Intel's $1 billion foundry deal?
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing