3DSP unveils optimized VoP software, development kit
3DSP unveils optimized VoP software, development kit
By Darrell Dunn, EBN
July 27, 2001 (12:55 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010725S0088
3DSP Corp. has introduced an optimized voice-over-packet (VoP) software suite and development kit for FPGA-based designs. The VoP software suite complements 3DSPC's portfolio of licensable DSP cores for use in developing system-level approaches for VoP equipment, said Tom Beaver, who became president and chief executive of the Irvine, Calif., company in January. The software is optimized for 3DSPC's architecture and supports requirements for customer-premise equipment, residential gateways, and next-generation switches, Beaver said. "We've tended to be a little recession proof. We don't have a warehouse of parts we're going to try and sell whether anyone wants them or not. We've been concentrating on helping customers innovate their way out of this current economic situation," he said. "Packet telephony is expected to become the fastest-growing market segment for semiconductors over the next decade," Beaver added. "Our technology will be abl e to provide the processing power to manage several hundred phone lines on a single chip." The suite includes a line-echo canceler that runs at about 3 million processor cycles a second, and a speech coder that runs at 3.5 million cycles a second for encode and decode, about twice as fast as existing DSP solutions, he said. The licensing fee for the software suite, which can be customized, begins at $20,000. 3DSPC's Sketchpad development kit will support the company's SP-3 or SP-5 configurable DSP cores, Beaver said. "The kit allows customers to realize a flexible DSP solution using a [Xilinx Inc.] FPGA that is on the board so that they can execute their code and accelerate development," he said. "Before committing to silicon, a customer can download to an FPGA to validate the performance and architectural changes." The Sketchpad kit begins at $19,950.OR
Related News
- Elliptic Technologies Unveils Industry Leading HDCP 2.0 Content Protection Solution
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
- OpenHW Group Announces RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
- Sigasi Introduces Software Development Kit for Electronic Design Automation Tools
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |