55nmHV MTP Non Volatile Memory for Standard CMOS Logic Process
New POLYN Patent Covers Smart Tires, Industrial IoT Applications
October 20, 2023 – POLYN Technology, a fabless semiconductor company supplying application-specific Neuromorphic Analog Signal Processing (NASP) technology and products, has been granted its first U.S. patent.
The new patent further strengthens not only the overall technological intellectual property (IP), but also the company’s special use cases portfolio. It also extends POLYN’s competitive advantage in performing efficient data preprocessing at the sensor edge using neural networks.
This patent specifically protects use of POLYN technology in “smart tire” applications, among others, where neural networks, implemented on the NASP chip revolutionize the amount and depth of information which can be transmitted from the tire to the driver’s dashboard and to the vehicle’s computer.
So far this year, five patents have been granted in the U.S. and other countries. The non-U.S. patents have broader scopes of claims to the underlying POLYN proprietary technology of converting neural networks into the corresponding semiconductor chips implementation; these provide the broadest protection of the company’s IP.
The U.S. patent is narrower, concentrating on specific applications of POLYN’s VibroSense™ technology segment, applicable not only to tires, but to the broader Industrial IoT segment. It demonstrates the company’s commitment to developing cutting-edge Neuromorphic Front-End (NFE) IP, based on NASP, that delivers exceptional power and performance efficiency.
“Our growing IP portfolio reflects more than four years of neuromorphic architecture research and development,” said Boris Maslov, Chairman of the Board of POLYN Technology. “As we continue to innovate and improve our technology at the Smart Thin Edge, we enable our partners to create unprecedented intelligent applications. The new patent further cements our leadership in on-sensor products and development of neuromorphic IP.”
The POLYN portfolio now includes more than two dozen additional patent applications pending in the U.S. Europe, Japan, Korea, India, China, and elsewhere.
|
Related News
- Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications
- Atmel Ships World’s Highest-Performing ARM Cortex-M7 based MCUs With Atmel | SMART SAM S/E Series Targeting IoT and Industrial Markets
- Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
- Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications
- Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |