Foundries News

• TSMC August 2012 Sales Report (Monday Sep. 10, 2012)
  TSMC today announced its net sales for August 2012: On an unconsolidated basis, net sales were approximately NT$48.9 billion, an increase of 2 percent over July 2012 and an increase of 32 percent over August 2011.
  
  
• UMC Reports Sales for August 2012 (Friday Sep. 07, 2012)
  UMC today reported unaudited net sales for the month of August 2012.
  
  
• UMC to Develop 65nm BSI CMOS Image Sensor Process with STMicroelectronics (Thursday Sep. 06, 2012)
  UMC today announced a collaborative effort with STMicroelectronics for 65nm CMOS image sensor technology using backside illumination (BSI).
  
  
• SMIC Interim Results: Double-Digit Growth in First Two Quarters (Thursday Aug. 30, 2012)
  SMIC today released its unaudited results for the six months ended June 30, 2012. Taking advantage of better-than-expected growth opportunities in the global semiconductor market, SMIC achieved stable growth in the first half of the year.
  
  
• UMC to shutter Japanese fab (Thursday Aug. 23, 2012)
  Taiwanese foundry United Microelectronics Corp. (UMC) said Tuesday (Aug. 21) its board of directors voted to close the company's 200-mm fab in Japan in an effort to cut costs amid difficult macroeconomic conditions and customer demand decline.
  
  
• TSMC Board of Directors Meeting Resolutions (Tuesday Aug. 14, 2012)
  TSMC Board approved capital appropriations of US$2,407.80 million to expand and upgrade advanced technology capacity, and capital appropriations of approximately US$378.73 million to construct a fab building and install facility systems
  
  
• ARM and GLOBALFOUNDRIES Collaborate to Enable Next-Generation Devices on 20nm and FinFET Process Technologies (Monday Aug. 13, 2012)
  GLOBALFOUNDRIES and ARM today announced a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer (nm) and FinFET process technologies.
  
  
• TSMC July 2012 Sales Report (Friday Aug. 10, 2012)
  TSMC today announced its net sales for July 2012: On an unconsolidated basis, net sales were approximately NT$47.92 billion, an increase of 11.8 percent over June 2012 and an increase of 37.3 percent over July 2011.
  
  
• SMIC Reports 2012 Second Quarter Results (Wednesday Aug. 08, 2012)
  SMIC today announced its consolidated results of operations for the three months ended June 30, 2012.
  
  
• TSMC and ASML Reach Agreement to Develop Next Generation Lithography Technologies as an Extension of Long-Term Partnership (Monday Aug. 06, 2012)
  TSMC today announced it has joined ASML Holding N.V. Customer Co-Investment Program, aimed at accelerating the development and industrialization of key next-generation semiconductor manufacturing technologies, which include extreme ultraviolet (EUV) lithography technology and 450-millimeter lithography tools. The agreement includes an investment amount of 838 million euros in ASML to acquire a 5% of its equity; and to commit 276 million euros, spread over 5 years, to ASML’s research and development programs.
  
  
• UMC Obtains LEED Gold Certification for Fab 12A P3 & P4 (Monday Jul. 30, 2012)
  UMC today announced that its 300mm Fab 12A P3 & P4 in Tainan, Taiwan, has gained LEED-NC (Leadership in Energy and Environmental Design – New Construction) Gold recognition from the U.S. Green Building Council.
  
  
• Rambus and GLOBALFOUNDRIES Demonstrate Outstanding Performance and Power Results in 28nm Silicon Test Chips (Wednesday Jul. 25, 2012)
  Rambus Inc. and GLOBALFOUNDRIES today announced the results from their collaboration on two separate memory architecture-based silicon test chips. The first test chip demonstrates solutions for mobile memory applications, such as smartphones and tablets. The second test chip demonstrates solutions for compute main memory applications, such as servers.
  
  
• GLOBALFOUNDRIES Extending Fab 8 to Meet Strong Customer Demand (Wednesday Jul. 25, 2012)
  GLOBALFOUNDRIES today announced it is moving forward with the final construction for the extension of Module 1 at the Fab 8 campus in New York. The project will add 90,000 square feet of manufacturing capacity, bringing the total capacity for Fab 8 Module 1 to 300,000 square feet. Construction activities are scheduled to begin in August and work is expected to be completed in December 2013.
  
  
• SMIC Raises Second Quarter 2012 Revenue and Gross Margin Guidance (Tuesday Jul. 24, 2012)
  SMIC is pleased to announce today an upward revision of its second quarter revenue and gross margin guidance for the three months ended June 30, 2012, which was originally released by SMIC in its results for the three months ended March 31, 2012 on May 10, 2012.
  
  
• TSMC Reports Second Quarter EPS of NT$1.61 (Thursday Jul. 19, 2012)
  TSMC today announced consolidated revenue of NT$128.06 billion, net income of NT$41.81 billion, and diluted earnings per share of NT$1.61 (US$0.27 per ADR unit) for the second quarter ended June 30, 2012.
  
  
• TSMC June 2012 Sales Report (Wednesday Jul. 11, 2012)
  TSMC today announced its net sales for June 2012: On an unconsolidated basis, net sales were approximately NT$42.87 billion, a decrease of 1.7 percent from May 2012 and an increase of 20.2 percent over June 2011.
  
  
• UMC Reports Sales for June 2012 (Monday Jul. 09, 2012)
  UMC today reported unaudited net sales for the month of June 2012
  
  
• UMC Aligns With IBM on 20nm Process with FinFET 3D Transistors (Friday Jun. 29, 2012)
  UMC today announced that it has licensed IBM technology to expedite the development of the foundry's next generation 20nm CMOS process with FinFET 3D transistors. Under the terms of the agreement, IBM will license its 20nm process design kit and FinFET technology to UMC so the foundry can use these technologies in order to accelerate the availability of these processes for UMC customers.
  
  
• SMIC and Synopsys Extend 40nm Low Power Capabilities with Reference Flow 5.0 (Tuesday Jun. 26, 2012)
  Synopsys and SMIC today announced availability of version 5.0 of their 40-nanometer (nm) RTL-to-GDSII reference design flow.
  
  
• Radiation Hardened SRAM Designed by RedCat Devices and Fabricated in TowerJazz's 0.18um Process Flow Withstands 15 Mrad Total Ionization Dose (Monday Jun. 25, 2012)
  RedCat Devices and TowerJazz announced today a breakthrough achievement in the design and fabrication of radiation hard ICs. As a part of the Program focused on the development of the radiation hard components, the companies for the first time report the results of testing RedCat’s 512 kbit SRAM (RC7C512RHH). The part has been designed by RedCat using its rad-hard standard cell library and IPs with the support of TowerJazz’s Design Center in Netania, Israel, and fabricated in TowerJazz’s Fab 2 in Migdal Haemek, Israel utilizing a flavor of its commercial 0.18-micron CMOS process flow.
  
  
• Analog Devices and TSMC Collaborate on New Analog Process Technology Platform (Thursday Jun. 21, 2012)
  Analog Devices and TSMC today announced a collaboratively developed analog process technology platform for precision analog integrated circuits (ICs). The new process technology platform significantly improves analog performance for a number of devices, including A/D and D/A converters, power management devices, and audio coders/decoders that are widely used in consumer, communication, computer, industrial, and automotive applications.
  
  
• SMIC and Brite Semiconductor's 40LL Dual-core ARM Cortex-A9 Processor-based Test Chip Achieves 1.3GHz (Wednesday Jun. 20, 2012)
  SMIC and Brite Semiconductor (Shanghai) Corporation today jointly announced that their dual-core ARM® Cortex™-A9 MPCore™ processor-based chip, adopting SMIC's 40nm LL (low-leakage) process technology, has achieved a clock rate of 1.3GHz in silicon tests.
  
  
• Dresden fab could host 20-nm process, 450-mm wafers (Tuesday Jun. 19, 2012)
  Fab 1, the 300-mm operation of GlobalFoundries Inc. here, could be used for 20-nm process technology and for processing 450-mm wafers, according to, Rutger Wijburg, vice president and Fab 1 general manager.
  
  
• TSMC May 2012 Sales Report (Friday Jun. 08, 2012)
  TSMC today announced its net sales for May 2012: On an unconsolidated basis, net sales were approximately NT$43.62 billion, an increase of 9 percent over April 2012 and an increase of 21.3 percent over May 2011.
  
  
• UMC Reports Sales for May 2012 (Friday Jun. 08, 2012)
  UMC TODAY reported unaudited net sales for the month of May 2012.
  
  
• GLOBALFOUNDRIES Silicon Validates 28nm AMS Production Design; Reveals Digital and AMS Support for Double Patterning at 20nm (Friday Jun. 01, 2012)
  GLOBALFOUNDRIES plans to demonstrate an enhanced silicon-validated design flow for its 28nm Super Low Power (SLP) technology with Gate First High-k Metal Gate (HKMG). In addition, the company will reveal jointly developed design flows with its EDA partners in certifying both analog and digital "double patterning aware" flows for its 20nm process, with silicon validation expected in early 2013 at that technology node.
  
  
• SMIC and Beijing Government Sign Cooperation Framework Document to Launch SMIC Beijing Second Phase Expansion Project (Tuesday May. 15, 2012)
  SMIC today announced the signing of a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, which will lead to the establishment of a joint venture to launch SMIC Beijing's Second Phase Expansion Project.
  
  
• TSMC April 2012 Sales Report (Friday May. 11, 2012)
  TSMC today announced its net sales for April 2012: On an unconsolidated basis, net sales were approximately NT$40.01 billion, an increase of 9.3 percent over March 2012 and an increase of 10.4 percent over April 2011.
  
  
• SMIC Reports 2012 First Quarter Results (Thursday May. 10, 2012)
  SMIC today announced its consolidated results of operations for the three months ended March 31, 2012. Revenue up by 14.9% to $332.7 million in 1Q12 from $289.6 million in 4Q11 and down by 10.2% compared to 1Q11.
  
  
• SMIC and Brite Semiconductor's 40LL Dual-core ARM Cortex-A9 Processor-based Test Chip Achieves 1.3GHz (Saturday Jun. 20, 1998)
  SMIC and Brite Semiconductor (Shanghai) Corporation today jointly announced that their dual-core ARM® Cortex™-A9 MPCore™ processor-based chip, adopting SMIC's 40nm LL (low-leakage) process technology, has achieved a clock rate of 1.3GHz in silicon tests.