Foundries News

• UMC Reports Sales for April 2012 (Wednesday May. 09, 2012)
  
  
  
• TSMC's 28nm Based ARM Cortex-A9 Test Chip Reaches Beyond 3GHz (Thursday May. 03, 2012)
  TSMC today announced its 28nm high performance ARM® Cortex(TM)-A9 dual-core processor test chip achieved 3.1GHz performance under typical conditions
  
  
• TSMC Reports First Quarter EPS of NT$1.29 (Thursday Apr. 26, 2012)
  TSMC today announced consolidated revenue of NT$105.51 billion, net income of NT$33.47 billion, and diluted earnings per share of NT$1.29 (US$0.22 per ADR unit) for the first quarter ended March 31, 2012.
  
  
• GLOBALFOUNDRIES Fab 8 Adds Tools To Enable 3D Chip Stacking at 20nm and Beyond (Thursday Apr. 26, 2012)
  GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, NY, the company has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company’s leading-edge 20nm technology platform.
  
  
• TSMC March 2012 Sales Report (Tuesday Apr. 10, 2012)
  TSMC today announced its net sales for March 2012: On an unconsolidated basis, net sales were approximately NT$36.61 billion, an increase of 9 percent over February 2012 and an increase of 0.7 percent over March 2011.
  
  
• SMIC Raises First Quarter 2012 Revenue and Gross Margin Guidance (Tuesday Apr. 10, 2012)
  SMIC is pleased to announce today an upward revision of its first quarter revenue and gross margin guidance for the three months ended March 31, 2012, which was originally released by SMIC in its results for the three months ended December 31, 2011 on February 8, 2012
  
  
• TSMC Begins Further Expansion of Fab 14 (Monday Apr. 09, 2012)
  TSMC today held a groundbreaking ceremony at the South Taiwan Science Park in Tainan for Phase 5 of its Fab 14 GigaFab. Following TSMC's Fab 12 Phase 6 in Hsinchu, this facility will be another key production center for TSMC’s advanced 20nm technology, providing TSMC with abundant leading-edge capacity.
  
  
• UMC Reports Sales for March 2012 (Monday Apr. 09, 2012)
  UMC today reported unaudited net sales for the month of March 2012.
  
  
• TowerJazz and UCSD Demonstrate First Silicon Wafer-Scale 110 GHz Phased Array Transmitter with Record Performance (Thursday Mar. 29, 2012)
  TowerJazz and The University of California, San Diego (UCSD) today announced they have collaborated to demonstrate the first wafer-scale phased array with 16 different antenna elements operating at 110 GHz frequency range.
  
  
• GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer (Thursday Mar. 22, 2012)
  GLOBALFOUNDRIES today announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology.
  
  
• X-FAB Extends High-Temperature Capability to 0.18 Micrometer Platform for Unique Combination of High Voltage, High Temperature and NVM Features (Tuesday Mar. 20, 2012)
  X-FAB Silicon Foundries today announced XH018 HT – a new module that adds high-temperature capability to its XH018 technology family. It offers the industry’s first and only 0.18 micrometer platform with high temperature (HT), high voltage (HV) and non-volatile memory (NVM) capability.
  
  
• Globalfoundries expects sales to AMD to increase (Thursday Mar. 15, 2012)
  Despite an amended wafer supply agreement that gives Advanced Micro Devices Inc. (AMD) the right to use other foundries to make its 28-nm accelerated processing units (APUs), Globalfoundries Inc. expects AMD to increase its business with the firm in 2012.
  
  
• SilTerra launches 130nm CMOS Logic Aluminum Backend Technology (Thursday Mar. 15, 2012)
  Malaysian-based wafer foundry SilTerra Malaysia today announced the release of 130nm CMOS Logic Technology with aluminum backend interconnection, CL130AL. This technology is targeting main stream, high volume consumer electronics applications such as Touch Controller, Flash Memory Card Controller, USB Pen-Drive controller, Card Reader, Host MP3 and others.
  
  
• SMIC, Brite, and Zhejiang University Found Joint IC Research Program (Wednesday Mar. 14, 2012)
  The IC research program will provide a world-class environment for research projects between the three parties. It will serve as a platform for cooperation, strengthening technology development and academic exchange while aligning with the university's educational tradition of "combining theory and practice."
  
  
• Soitec announces adoption of fully depleted technology for advanced mobile platforms (Tuesday Mar. 13, 2012)
  Soitec announced today that ST-Ericsson has selected planar fully depleted silicon on insulator (FD-SOI) technology for use in future mobile platforms.
  
  
• TSMC February 2012 Sales Report (Friday Mar. 09, 2012)
  TSMC today announced its net sales for February 2012: On an unconsolidated basis, net sales were approximately NT$33.58 billion, a decrease of 1.4 percent over January 2012 and an increase of 5.8 percent over February 2011.
  
  
• UMC Reports Sales for February 2012 (Thursday Mar. 08, 2012)
  UMC today reported unaudited net sales for the month of February 2012
  
  
• AMD Amends Wafer Supply Agreement With GLOBALFOUNDRIES (Monday Mar. 05, 2012)
  AMD today announced that it entered into an amendment to its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. In this amendment, AMD and GLOBALFOUNDRIES agreed to a negotiated wafer price mechanism for 2012. AMD also agreed to transfer its remaining ownership interest in GLOBALFOUNDRIES to GLOBALFOUNDRIES and, as a result, AMD will no longer hold an equity stake in GLOBALFOUNDRIES.
  
  
• TSMC Board of Directors Resolution (Friday Mar. 02, 2012)
  The TSMC Board of Directors today held a special meeting and approved the appointment of Senior Vice President of R&D Dr. Shang-yi Chiang, Senior Vice President of Operations Dr. Mark Liu, and Senior Vice President of Business Development Dr. C.C. Wei as Executive Vice Presidents and Co-Chief Operating Officers of TSMC.
  
  
• SMIC and Brite Semiconductor Tape Out Low Leakage 40nm Test Chip Based on a Dual-Core ARM Cortex-A9 Processor (Monday Feb. 27, 2012)
  Brite Semiconductor, SMIC and ARM today jointly announced the first tape out of a dual-core ARM® Cortex™-A9 MPCore™ test chip using SMIC's 40nm low leakage process technology.
  
  
• Samsung positions its fab to take on TSMC (Wednesday Feb. 22, 2012)
  Samsung touted its new 32-nm high-k metal gate (HKMG) process at the International Solid-State Circuits Conference here Tuesday (Feb. 21), showing features it hopes might win customers over from a supply constrained TSMC.
  
  
• Japanese Ministry of Economy, Trade and Industry has Approved Grants to TowerJazz for its Cap-Ex Investment Plan (Monday Feb. 13, 2012)
  TowerJazz today announced that TowerJazz Japan, Ltd. (TJP) has been selected to receive a cap-ex subsidy from the Japanese Ministry of Economy, Trade and Industry (METI).
  
  
• TSMC January 2012 Sales Report (Friday Feb. 10, 2012)
  TSMC today announced its net sales for January 2012: On an unconsolidated basis, net sales were approximately NT$34.05 billion, an increase of 11.4 percent over December 2011 and a decrease of 1.1 percent over January 2011.
  
  
• Analyst: UMC 28-nm roll out beating expectations (Friday Feb. 10, 2012)
  UMC. is sampling a customer with a 28-nm application processor amid indications that the roll out of the leading-edge process technology is going better than expected.
  
  
• SMIC Reports Results for the Three Months Ended December 31, 2011 (Thursday Feb. 09, 2012)
  SMIC Reports Results for the Three Months Ended December 31, 2011. Revenue down by 5.6% to $289.6 million in 4Q11 from $306.9 million in 3Q11 and down by 29.1% compared to 4Q10.
  
  
• UMC to boost 2012 capex to $2 billion (Thursday Feb. 09, 2012)
  UMC said Wednesday (Feb. 8) it plans to spend about $2 billion on capital expenditures in 2012, up 25 percent from the roughly $1.6 billion it spent on capital expenditures in 2011.
  
  
• UMC Reports Sales for January 2012 (Thursday Feb. 09, 2012)
  UMC today reported unaudited net sales for the month of January 2012.
  
  
• TSMC Reports Fourth Quarter EPS of NT$1.22 (Wednesday Jan. 18, 2012)
  TSMC today announced consolidated revenue of NT$104.71 billion, net income of NT$31.58 billion, and diluted earnings per share of NT$1.22 (US$0.20 per ADR unit) for the fourth quarter ended December 31, 2011. Year-over-year, fourth quarter revenue decreased 4.9% while both net income and diluted EPS decreased 22.5%.
  
  
• TSMC December 2011 Sales Report (Tuesday Jan. 10, 2012)
  TSMC today announced its net sales for December 2011: On an unconsolidated basis, net sales were approximately NT$30.57 billion, a decrease of 13.2 percent over November 2011 and a decrease of 9.4 percent over December 2010.
  
  
• IBM and GLOBALFOUNDRIES Begin First Production At New York's Latest Semiconductor Fab (Tuesday Jan. 10, 2012)
  GLOBALFOUNDRIES and IBM today announced an agreement to jointly manufacture advanced computer chips at both companies' semiconductor fabs in New York's "Tech Valley." The new products recently began initial production at IBM's 300mm fab in East Fishkill and GLOBALFOUNDRIES' Fab 8 in Saratoga County, and are planned to ramp to volume production in the second half of 2012.