USB4 Gen3X2 and DP1.4 X4 PHY IP with Type-C connector support
Qualcomm Makes First Call with Chips Using TSMC's 45nm Technology
SAN DIEGO -- Nov. 13, 2007 -- Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies and data solutions, today announced it has made the first call on a 3G chip manufactured with 45 nanometer (nm) process technology. The next generation of CMOS semiconductor manufacturing, 45 nm technology enables chips that feature higher speeds, lower power consumption and enhanced integration with reduced die cost by providing more die per wafer. Qualcomm’s test call was made on the first 45nm chips received from Taiwan Semiconductor Manufacturing Company (TSE: 2330, NYSE: TSM), the world’s largest dedicated semiconductor foundry.
“Thanks to our close strategic foundry partner relationships, Qualcomm is able to leverage leading-edge semiconductor process technology to advance wireless communications," said Steve Mollenkopf, senior vice president of product management for Qualcomm CDMA Technologies. “This milestone call demonstrates our progress toward bringing to market a new generation of chips that will provide users with unprecedented performance and capabilities.”
“First time silicon success of Qualcomm’s 3G product using TSMC’s 45nm process is a testament to the integrated foundry model that calls for end-to-end collaboration. The concurrent design and technology collaboration between the two companies has resulted in faster time to market,” said Mark Liu, senior vice president of Operations II at TSMC. “The confluence of Qualcomm’s excellent designs and TSMC’s robust technologies and manufacturing will continue to assure future silicon success.”
Qualcomm recently taped out on its low-power-optimized 45 nm process using advanced immersion lithography and extreme low-k inter-metal dielectric material. This process technology provides competitive performance as well as significant cost efficiency, decreased leakage and increased integration. The Company is also developing 40 nm process technology, which should deliver even greater benefits in semiconductor performance, cost and efficiency.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
|
Related News
- Qualcomm Reportedly Taps TSMC's 7nm
- SMIC's 28nm Chips Power Mainstream Smartphones Marking a New Era for Advanced Chip Manufacturing in China
- Chips&Media to Exhibit at the 1'st TSMC OIP Ecosystem Forum
- Chips&Media Joins TSMC's Soft-IP Alliance Program
- NXP and TSMC Deliver Industry's First 45nm Single-Chip Digital TV Platform
Breaking News
- Arm revenues up 47%; shares fall
- Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems
- X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
- Softbank reported to be in talks to buy Graphcore
- VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification
Most Popular
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
- Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip
- sureCore announces successful tape-out of cryogenic IP demonstrator
- Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
- Announcing Availability of Silicon-Proven 12bit 1Msps SAR ADC IP Core for Whitebox Licensing with Royalty Free
E-mail This Article | Printer-Friendly Page |