This is How Intel Gets Out of Manufacturing
It won’t be easy, but it could be done
By Jim McGregor, Tirias Research
EETimes (February 2, 2021)
On the heels of activist hedge fund Third Point calling on Intel’s board to explore “strategic alternatives,” like spinning off its fabs and/or divesting itself of unsuccessful acquisitions, Intel’s board reacted with a rapid change of CEOs, tapping Pat Gelsinger to succeed Bob Swan. However, in his first address to the financial community, Gelsinger committed Intel to remaining an integrated design manufacturer (IDM) — and, yes, that might require outsourcing some manufacturing to third-party fabs in the near term. While this may not please some investors, it is the correct decision at this time. However, I have a theory on how a spinoff could be successful, theoretically, in the long-term, say five years or more down the road
E-mail This Article | Printer-Friendly Page |
Related News
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
- How Investments in Manufacturing will Benefit the Semiconductor Ecosystem
- PathPartner Collaborates with Intel to Deliver AI-based Weld Defect Detection to the Manufacturing Industry
- Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership
- TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
Breaking News
- CAN FD Controller & LIN 2.1 Controller IP Cores, Available for Immediate Licensing with Proven Automotive Compatibility
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
- TSMC plans 1.6nm process for 2026
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process