EU Turns Rivals into Allies
By Anne-Françoise Pelé, EETimes Europe (September 25, 2023)
For the sake of domestic security and global competitiveness, the EU turns a blind eye to business rivalries.
Germany is a favorite. After Intel got the go-ahead this summer to expand its planned footprint in Magdeburg, TSMC received the green light for a joint-venture fab in Dresden. The pledges come at a make-or-break moment for long-term competitiveness for the EU.
A sense of responsibility and a sentiment of “never again” emerged as Europe faced severe semiconductor supply chain disruptions and challenges in the post-Covid-19 economy. Over the years, Europe had ceded vast amounts of its market share in semiconductor manufacturing, and its reliance on imports had become particularly troublesome in industries such as automotive and consumer electronics. The EU Chips Act, proposed in February 2022 and passed into law in July 2023, aims to enhance resilience, strategic autonomy and security of supply in semiconductors.
In the semiconductor industry, working in unison and rallying collective strengths have often paid off. In this respect, the creation of a European chip champion has been a recurring theme.
E-mail This Article | Printer-Friendly Page |
Related News
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
- Qualinx partners with EU Space Agency to develop a GNSS receiver for a service to detect spoofing and boost resilience
- Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act
- Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU
- EU agrees Chips Act terms
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance