inSilicon, HP and NEC Unveil USB 2.0 Demonstration at USB 2.0 Developers Conference

inSilicon Communications IP Complements Multi-vendor Interoperability

USB 2.0 Developers Conference, Anaheim, Calif., May 16, 2000 - inSilicon Corporation (Nasdaq: INSN), a leading provider of communications technology for systems-on-a-chip - today announced a working, multi-vendor implementation of the new Universal Serial Bus (USB) 2.0.

Demonstrated today at the USB 2.0 Developers Conference in Anaheim, California, a Hewlett-Packard ScanJet scanner using an FPGA-based inSilicon USB2.0 device core (UDC) transmitted a scanned image to a personal computer at bursts of 480 megabits per second. This rate is 40 times faster than the current USB 1.1 specification. The HP USB 2.0 capability is enabled in the scanner demonstration through an inSilicon device controller, operating in conjunction with a NEC Corporation USB 2.0 Phy test chip, communicating via a standard USB cable to an NEC Host Controller mounted on a PCI card in a PC.

"We are excited that HP chose inSilicon as the development collaborator for demonstrating USB 2.0 device functionality," said Eric Huang, USB Product Marketing Manager of inSilicon. "This example of end-to-end USB 2.0 transfers, provides designers with a silicon-based verification of inSilicon's TymeWare[tm] USB 2.0 device controller capability."

"Our investment in the USB 2.0 standards illustrates how HP continues to create innovative products with the latest technology," said Ed Beeman, USB 2.0 Product Architect Manager for HP's Greeley Hardcopy Division. "The availability of building blocks from inSilicon, NEC, and Intel are enabling HP to lead the way in offering USB 2.0 products with this new technology."

"Seeing is believing. The demonstration shows high bandwidth for serious multimedia applications together with the ease of use consumers want. Now that we've all shown the first working USB 2.0 devices, the next stage is to get it into PCs for the Christmas season," said Takahiro Tokuume, Senior Manager in NEC's Solution Engineering Division, and member of the Board of Directors of the USB Implementers Forum, Inc.

USB enables cost-effective, outside-the box connectivity with hot-swap capability for industrial, consumer, embedded, PC, and PC peripheral products. USB requires a host to manage and control bus traffic, and peripherals such as printers, scanners, and digital cameras to communicate with the host. USB 2.0 is a proposed specification designed to increase USB performance. USB 2.0 is fully compatible with USB 1.1.

"This early demonstration of USB 2.0 by HP, inSilicon, and NEC is the next step in the evolution of USB," added Jason Ziller, USB Platform Initiatives Manager at Intel Corporation. "It demonstrates both the power and practicality of implementing USB 2.0. Early adopters will provide the leadership and expertise to create a new generation of compelling, high-performance PC peripherals and applications."

About inSilicon
inSilicon Corporation is a leading provider of communications and connectivity technology used by semiconductor and systems companies to design complex systems-on-chip that are critical components of digital devices. inSilicon's technology provides customers faster time-to-market, and reduced risk and development cost. The Company's enabling communications technologies, including Ethernet, USB, PCI, IEEE 1394 are used in a wide variety of markets encompassing communications, consumer, computing, and office automation.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995:

In addition to the historical information contained herein, statements in this press release may contain forward-looking statements within the meaning of the Federal securities laws and are subject to the safe harbors created thereby. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: the risks that products will fail to achieve market acceptance, the timing of customer orders, delays in the design process, the length of inSilicon Corporations' sales cycle, inSilicon Corporation's ability to develop, introduce and market new products and product enhancements, changes in product mix or distribution channels; the demand for semiconductors and end-user products that incorporate semiconductors; technological difficulties and resource constraints encountered in developing and/or introducing new products; natural disasters/acts of God; and other risks both domestic and international. Forward-looking statements contained in this press release regarding expected financial results, industry trends, sales and future product development and business strategies and activities should be considered in light of these factors and those factors discussed from time to time the Company's public reports filed with the Securities and Exchange Commission, such as those discussed under "Risk Factors"' in the Company's report on form S-1 filed in March 2000.

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