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Fabless / IDM News

• Conexant Launches Family of Highly Integrated VoIP Solutions for Enterprise and Consumer Phone Applications (Tuesday Sep. 06, 2005)
  Single-Chip, Feature-Rich IP 'Phone-on-a-Chip' Delivers Cost and Performance Benefits
  
  
• Jennic announces availability of world's first single-chip IEEE 802.15.4 wireless microcontroller (Monday Sep. 05, 2005)
  The JN5121 is unique since it combines a 32-bit RISC core, fully compliant 2.4GHz IEEE802.15.4 transceiver and integrated 64KB ROM and 96KB RAM memory blocks, all in a single 8x8mm 56 lead QFN chip package
  
  
• Zoran Corporation Offers DivX Ultra Certified IC Solution for Next Generation DVD Players (Friday Sep. 02, 2005)
  Vaddis ICs Enable Playback of Advanced Interactive Features
  
  
• Renesas Technology Releases 32-Bit SuperH Family SH7650 Offering Industry's First Single-Chip Implementation of DTCP-IP Content Protection Standard Compatible Functions (Thursday Sep. 01, 2005)
  On-chip Ethernet controller, enabling DTCP-IP standard compatible high definition digital content network transfer with a single chip
  
  
• TI Launches Massive MCU Portfolio Expansion With Industry’s Smallest, Lowest Power Devices (Tuesday Aug. 30, 2005)
  MSP430F20xx MCUs Are First of 50 New Devices in Next 18 Months for Industry's Broadest Ultra-Low Power MCU Portfolio
  
  
• Chip makers place their bets in mobile-TV silicon (Monday Aug. 29, 2005)
  As the consumer market's interest in digital TV expands from large-screen sets in the living room to portable TVs in notebook computers, cars and mobile phones, silicon development activities are heating up
  
  
• STMicroelectronics Moves 128-Mbit NAND Flash Chip to 90nm Production Technology (Monday Aug. 29, 2005)
  Small-Page NAND128 is the Only 128-Mbit NAND Flash Device Produced in 90nm Technology, Improving Cost Competitiveness of Consumer Equipment Manufacturers
  
  
• SMSC Announces Smallest Footprint Hi-Speed USB UTMI+ Device/Host Stand-Alone Transceiver (Thursday Aug. 25, 2005)
  USB3450 Provides Hi-Speed USB Host Support for Portable Consumer Electronics Products
  
  
• Rad-Hard 8051 Microcontroller Mates with Honeywell MRAM for Two-Chip, 300 krad Space Ampplications Solution (Tuesday Aug. 23, 2005)
  Rad-Hard 8051 Microcontroller Mates with Honeywell MRAM for Two-Chip, 300 krad Space Ampplications Solution
  
  
• New SteelVine Storage Processor from Silicon Image Enables Affordable, High-Performance, Two-Drive 3Gb/s SATA Solutions (Tuesday Aug. 23, 2005)
  SiI 4723 Features Easy RAID Configuration of Fast, Big, or Safe Modes, Providing Flexible and Easy to Use CE and Home Storage Solutions
  
  
• Samsung Electronics Develops DVB-H Chipset with Zero-IF CMOS RF Tuner and SoC Channel Decoder (Monday Aug. 22, 2005)
  The DVB-H standard compliant SoC baseband channel decoder (S3C4F10) represents the industry’s first single-chip channel decoder solution, completed with all memories needed for Link Layer operations such as MPE-FEC decoding and IP-Decapsulation
  
  
• Zoran Corporation Announces New Reference Design for High Quality, Cost Effective High Definition Televisions (Monday Aug. 22, 2005)
  SupraHD 660 Drives Low Cost Digital Chassis for CRT, LCD and Plasma HDTVs
  
  
• Broadcom to Demonstrate the Industry's First PCI Express(R)-based SAS/SATA RAID-on-Chip (RoC) Solution at IDF (Monday Aug. 22, 2005)
  Third Generation RAID Architecture Demonstrates Significant Advancements in RAID Technology Featuring the Industry Smallest Form Factor, the Lowest Power and Thermal Requirements, and Usage Flexibility via Its XelCore(TM) RAID Stack
  
  
• Telairity Semiconductor Launches Telairity-1: Real-Time H.264 High-Definition Video Architecture Delivers Highest Level of Video Processing Available in a Single Chip (Monday Aug. 15, 2005)
  Harnessing multiple independent vector/scalar cores, the multicore Telairity-1 architecture is specifically designed to handle the demanding computational requirements of the H.264 (MPEG-4 Part 10) HD codec
  
  
• Samsung Accelerates Shift to High-Performance Computing by Producing More DDR2 than DDR1 Memory (Thursday Aug. 11, 2005)
  Samsung Accelerates Shift to High-Performance Computing by Producing More DDR2 than DDR1 Memory
  
  
• IPFlex to Introduce Industry-Leading Dynamically Reconfigurable Processor and C-Based Design Environment at Hot Chips 17 and HPEC 2005 (Wednesday Aug. 10, 2005)
  DAPDNA-2 and DAPDNA-FW II Expected to Dazzle Participants with Technological Innovation and Market Potential
  
  
• Cypress Offers New KISSBind(TM) Capability for WirelessUSB(TM) Radio-On-a-Chip Devices (Wednesday Aug. 10, 2005)
  New Feature Allows WirelessUSB Peripherals and Hosts to Link With a Simple Electronic Kiss, Avoiding User Installation Headaches
  
  
• ProMOS pulls in 90nm mass production schedule, fueling 2H’05 operating performance (Tuesday Aug. 09, 2005)
  ProMOS Technologies (5387.TWO) today announced that the pilot run result of 90nm stack technology node at ProMOS 300mm Fab 3 has successfully performed with production yield at 80%
  
  
• Renesas Technology Releases SH7261 SuperH Microcontrollers for Digital Audio Products (Tuesday Aug. 09, 2005)
  Enabling single-chip system control and audio signal processing for digital audio products, and providing digital audio solutions including various kinds of middleware
  
  
• FSA Expands Worldwide Leadership (Monday Aug. 08, 2005)
  Leadership Team Reflective of Global Semiconductor Industry
  
  
• Open-Silicon Introduces IC-Catalyst - an Integrated Platform for Chip Design and Manufacturing (Monday Aug. 08, 2005)
  Integrated Platform Delivers Predictable, Reliable and Cost-effective ASICs
  
  
• Infineon's Multimedia Phone Platform for GSM/GPRS Used in Latest Mobile Phones of Panasonic Mobile Communications (Monday Aug. 08, 2005)
  Infineon Technologies AG (FSE/NYSE: IFX) today announced that its GSM/GPRS multimedia reference design platform has been selected by Panasonic Mobile Communications Co., Ltd
  
  
• Conexant Launches Family of DVB Decoders for Mass Market, Free-to-Air Set-Top Boxes (Monday Aug. 08, 2005)
  Shanghai Design Center Delivers Highly Integrated, Cost-competitive Chips for Global FTA Market
  
  
• SMSC Provides Industry's First ULPI Stand-Alone Transceiver for Hi-Speed USB Industry Specification (Monday Aug. 08, 2005)
  Newly Released ULPI Interface Promotes Stand-Alone PHYs for Consumer Electronics Products Requiring Hi-Speed USB
  
  
• LSI Logic Delivers Ultra-Sleek LSI403US DSP to Enable Growing Voice Over WLAN Handheld Market (Tuesday Aug. 02, 2005)
  Ultra-thin 7 mm x 7 mm package perfect for Voice over WiFi in cell phones and other small form factor end products
  
  
• FSA Releases FSA Mixed-Signal/RF SPICE Model Checklist (Monday Aug. 01, 2005)
  Defines Quality Criteria, Aiding Designers in Making Foundry Process and IC Decisions
  
  
• SigmaTel Secures Intellectual Property and Adds Renowned Design Team from D&M Holdings Inc. (Tuesday Jul. 26, 2005)
  Acquisition Strengthens SigmaTel IP; Addition of Respected Rio(R) Technology Design Team Increases SigmaTel's Hard Drive System Expertise and Expands Global Reach
  
  
• Conexant Enters Fiber Optic Access Market with World's Most Integrated and Lowest Cost System-on-a-Chip (Tuesday Jul. 26, 2005)
  Solution Targets Fiber-to-the-Home and Fiber-to-the-Neighborhood Applications
  
  
• AMI Semiconductor Opens Offshore Center in India for Worldwide Design Support (Monday Jul. 25, 2005)
  Bangalore Center Taps Local Engineering Talent and Enhances Silicon Design Capabilities for Automotive, Medical and Industrial Applications
  
  
• Taiwan looks to chip design as growth engine, says report (Thursday Jul. 21, 2005)
  Taiwan’s Ministry of Economic Affairs plans to help develop three to five major fabless chip companies to help the country achieve economic goals set for 2012